The newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology
With the push from various energy-saving applications, the overall IGBT market was worth USD860 Million in 2016. 25 million electrified vehicles were sold last year.
As vehicle numbers increased worldwide and people adopted electrified vehicles, IGBT sales in automotive applications showed rapid growth. This will continue at a fast pace from 2016–2022.
As one of the leading vendors of IGBTs, Infineon has devoted more than 20 years to device design innovation. It now commands more than 20 percent of the market, leading in both IGBT discretes and modules.
The HybridPACK Drive power module is the latest power packaging specifically designed for automotive applications. The FS820R08A6P2B drives 820A and uses a new copper pin-fin dissipation structure optimized for direct liquid cooling. This improves its thermal cycling capability and extends the lifetime of the power module.
The terminals are connected directly to the Direct-Bonded Copper (DBC) substrate, without wire bonding. The new press-fit pin technology allows easy and optimized system integration.
The IGBT diode is manufactured with the new Electric Drive Train 2 (EDT2) design, which reduces conduction and switching losses. The innovative structure is based on Micro-Pattern-Trench-Field-Stop cell design and is composed of active gate, source and dummy gates with inactive mesas.
Based on a complete teardown analysis, the report provides an estimation of the production cost of the IGBT, diode and package. It offers a comparison between Infineon’s IGBT4 and EDT2 devices and HybridPACK 2 and HybridPACK Drive modules.
It highlights the differences in design and manufacturing processes and their impact on device size and production cost.
Overview / Introduction
> Executive Summary> Reverse Costing Methodology
> Overview of the Physical Analysis> Package Analysis- Package opening- Package cross-section
> IGBT Die- IGBT die view and dimensions- IGBT die process - IGBT die cross-section- IGBT die process characteristics
> MEMS Die- View, dimensions and marking- Sensing area details- Cross-section sensor capacitor- Cross-section reference capacitor- Process characteristics> Comparison
IGBT Manufacturing Process
> IGBT Die Front-End Process> IGBT Die Fabrication Unit> Final Test and Packaging Fabrication Unit
> Overview of the Cost Analysis> Yield Explanations and Hypotheses> IGBT Die- IGBT die front-end cost- IGBT die probe test, thinning and dicing- IGBT wafer cost- IGBT die cost
> Complete IGBT- Packaging cost- Final test cost- Component cost
> Estimation of Selling price
> Comparison with Infineon HybridPACK 2> Comparison Between Infineon IGBT4 and IDT2
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.
System Plus Consulting engineers are experts in:
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement.
More info at www.systemplus.fr
Detailed photos and identification
SEM and EDX analysis of epitaxy layers and transistor structure
Manufacturing process flow
In-depth economic analysis
Manufacturing cost breakdown
Selling price estimation
Comparison with Infineon HybridPACK 2
Comparison between IGBT4 and EDT2