Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Infineon RASIC: RRN7740 & RTN7750 76GHz Radar Dies
Feb.2016

infineon_rasic_image
1 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 39% on your package – Contact us!

 

Description

Yole Infineon RRN7740 and RTN7750 SiGE HBT icone

New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon

The new integrated Radar and Camera (RACam) 76GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.

The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB. The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.

The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.

Infineon offer several RASIC with different package (bare die, eWLB). in order to understand the choice made by Delphi, the RF function and design are compared with the Infineon RRN7745P and RTN7735P (eWLB packaging) found in the Bosch MRR1Plus automotive radar.

 Infineon RASIC image 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction

 

Infineon Company Profile

 

Physical Analysis

Radar system
> Integration of the die
> System Comparison

Die
> Die View & Dimensions
> Main Blocks Identification
> Die Marking
> Die Process
> Die Comparison
> Die Integration
> Die Cross-Section


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cost Analysis

Hypotheses
> Component Summary
> Front-End Summary
> Wafer Fabrication Unit
> Back-End: Probe Test, Backgrinding & Dicing
> Back-End: Final Test

Cost Analysis
> Yields Synthesis
> Unprobed Wafer Cost
> Die Cost
> Final Test Cost
> Component Cost

 

Estimated Price Analysis

Infineon Financial Results
Component Selling Price

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Detailed Functions

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison with Infineon RRN7745 & RTN7735 eWLB

Related reports

About

Activities

Fields of expertise