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Infineon SP37 Tire Pressure Monitoring Sensor
Feb.2014

infineon sp37 tpms photos v2
2 990 €

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Description

Yole Infineon SP37 MEMS TPMS IconeFlyer.pdf -Highly Integrated & Reliable Tire Pressure Monitoring Sensor

With more than 150 million TPMS sensors sold worldwide, Infineon Technologies is one of the leaders on the TPMS market.
The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPMS sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.


The SP37 sensors inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.

The SP37 sensors is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
Infineon SP37 TPMS photos
This report will provide a complete teardown of the MEMS pressure sensor, the accelerometer and the ASIC (microcontroller & RF transmitter) of the SP37 TPMS with:

• Detailed photos
• Material analysis
• Manufacturing Process
• In-depth manufacturing cost analysis
• Supply chain evaluation
• Selling price estimation




Table of contents

Glossary
Overview/Introduction
Infineon Company Profile
Physical Analysis
> Physical Analysis Methodology
> Package
- Package Views, Dimensions& Marking
- Package X-Ray
- Package Opening
- Package Cross-Section
> ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks
- Cross-Section
- Process Characteristics
> MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed
- Sensing Area
- Cross-Section:
- Accelerometer Cross-Section
- Pressure Sensor Cross-Section

Manufacturing Process Flow

> Global Overview
> ASIC Front-End Process
> ASIC Wafer Fabrication Unit
> MEMS Process Flow
> MEMS Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit

Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> ASIC Front-End Cost
> ASIC Back-End 0 : Probe Test & Dicing
> ASIC Wafer & Die Cost
> MEMS Front-End Cost
> MEMS Back-End 0 : Probe Test & Dicing
> MEMS Front-End Cost per process steps
> MEMS Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test Cost
> Component Cost

Estimated Price Analysis
> Infineon Financial Ratios
> SP37 Estimated Price



SYSTEM PLUS CONSULTING

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
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− MEMS & Sensors
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− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
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Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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