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Infineon SP37 Tire Pressure Monitoring Sensor

infineon sp37 tpms photos v2
2 990 €

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Yole Infineon SP37 MEMS TPMS IconeFlyer.pdf -Highly Integrated & Reliable Tire Pressure Monitoring Sensor

With more than 150 million TPMS sensors sold worldwide, Infineon Technologies is one of the leaders on the TPMS market.
The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPMS sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.

The SP37 sensors inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.

The SP37 sensors is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
Infineon SP37 TPMS photos
This report will provide a complete teardown of the MEMS pressure sensor, the accelerometer and the ASIC (microcontroller & RF transmitter) of the SP37 TPMS with:

• Detailed photos
• Material analysis
• Manufacturing Process
• In-depth manufacturing cost analysis
• Supply chain evaluation
• Selling price estimation

Table of contents

Infineon Company Profile
Physical Analysis
> Physical Analysis Methodology
> Package
- Package Views, Dimensions& Marking
- Package X-Ray
- Package Opening
- Package Cross-Section
> ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks
- Cross-Section
- Process Characteristics
> MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed
- Sensing Area
- Cross-Section:
- Accelerometer Cross-Section
- Pressure Sensor Cross-Section

Manufacturing Process Flow

> Global Overview
> ASIC Front-End Process
> ASIC Wafer Fabrication Unit
> MEMS Process Flow
> MEMS Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit

Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> ASIC Front-End Cost
> ASIC Back-End 0 : Probe Test & Dicing
> ASIC Wafer & Die Cost
> MEMS Front-End Cost
> MEMS Back-End 0 : Probe Test & Dicing
> MEMS Front-End Cost per process steps
> MEMS Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test Cost
> Component Cost

Estimated Price Analysis
> Infineon Financial Ratios
> SP37 Estimated Price


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

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