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Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector

3 290 €

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real sense flyer

Innovative 3D camera for facial analysis and hand/finger tracking, based on resonant micro-mirror, IR laser, visible and near infrared image sensors.

Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.

The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.

real sense img
The IR laser projector from STMicroelectronics integrates an infrared laser diode, low power class 1, and a resonant micro-mirror manufactured by STMicroelectronics. The projector is tiny, only 11.7mm x 8.4mm x 3.1mm and has a capability of 60fps.
STMicroelectronics has developed an intelligent design to reduce the dimension of the micro-mirror, facilitating its driving and dramatically reducing the number of manufacturing steps in order to reduce the cost.

real sense img2
Based on a complete teardown analysis of the RealSense 3D Camera and the STMicroelectronics IR Laser Projector, the 2 reports provide the bill-of-material (BOM) and the manufacturing cost of the 3D Camera Module as well as a complete physical analysis and manufacturing cost estimation of the IR Laser Projector.


RealSense 3D camera:

  • Module Teardown
  • Bill of Material
  • Processor Analysis
  • Visible & IR sensors
  • Manufacturing Cost
  • Selling Price

IR Laser Projector:

  • Detailed Photos
  • Laser Diode
  • Micro-mirror
  • MEMS Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation

Table of contents

Intel RealSense 3D Camera Module


Intel Company Profile



  • Physical Analysis Methodology
  • Module Teardown
  • Electronic Boards


Cost Analysis

  • Accessing the BOM
  • Estimation of the Cost of the PCBs
  • Estimation of the Intel Processor
  • Estimation of the cost of the Sensors
  • BOM Cost – Electronic Boards
  • Accessing the Added Value (AV) cost
  • Electronic Boards Manufacturing Flow
  • Details of the Module Assembly AV Cost
  • Manufacturing Cost Breakdown
  • Estimation of the Manufacturing Price - Intel

Resonant Micro-Mirror

STMicroelectronics Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • IR Laser Projector

 > Package Characteristics & Pin-out
 > Package Opening & Wire Bonding Process
 > Lens Line
 > Laser Diode

  • Resonant Micro-Mirror

 > View, Dimensions & Marking
 > Resonant Micro-Mirror
 > Comb
 > Thickness
 > Bonding
 > Cross-Section

Manufacturing Process Flow

  • Global Overview
  • MEMS Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost

Price Analysis

  • Selling Price Estimation


System Plus Consulting

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.