InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub
Apr.2016

Overview / Introduction

Invensense Company profile

Physical Analysis

> Physical analysis
- Physical analysis methodology
> Package
- Package characteristics: view, dimensions, and opening
- Package cross-section
> MEMS Dies
- View, dimensions, and markings
- Bond pad opening and bond pad
- MEMS cap removed and details
- Sensing area details
- MEMS cross-section
- MEMS process characteristics
> MCU Die
- View, dimensions, and markings
- Delayering and main blocks ID
- Process and die cross-section
- Die process characteristics

Manufacturing Process Flow

- Global overview
- ASIC & MCU front-end process
- MEMS process flow
- ASIC and MCU wafer fabrication unit
- Packaging process flow and assembly unit

Cost Analysis

- Main steps of economic analysis
- Yields hypotheses
- ASIC & MCU front-end cost
- MEMS front-end cost
- MEMS MEMS assembly cost
- ASIC & MCU back-end 0: probe test and dicing
- ASIC & MCU wafer & die cost
- MEMS front-end cost
- MEMS front-end cost per process steps
- MEMS back-end 0: probe test and dicing
- MEMS wafer and die cost
- Wafer & die cost
- MCU die cost
- Back-end: packaging cost
- Back-end: packaging cost per process steps
- Back-end: final test cost
- Component cost and price

Comparison with Bosch BMF-055 9-Axis Sensor Hub and previous-generation 6-Axis IMU

ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.