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InvenSense MPU-9250 9-Axis MEMS IMU

photo invensense mpu-9250 9-axis imu
2 990 €

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SC InvenSenseMPU9250 20142nd Gen. of InvenSense IMU - The Smallest 9-Axis IMU with only 9mm² footprint 40% area decrease of the gyro & magneto through key changes of the Nasiri process

For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB.


Detailed Photos
Precise Measurements
Material Analysis
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation

Photo Invensense MPU-9250 9-Axis IMU

Table of contents

Overview/Introduction , Companies Profile
Physical Analysis
> Package
- Package Views & Dimensions
- Package Opening
- Wire bonding Process
- Package Cross-Section
>MPU-6500 Die
- View, Dimensions & Marking
- MEMS Removed
- MEMS Sensing Area
- MEMS Cap
- ASIC Delayering & Process
- Die Cross-Section: ASIC
- Die Cross-Section: MEMS
- Die Cross-Section: Sensor
- Die Cross-Section: Cap
>AK8963 Die
- View, Dimensions & Marking
- Hall Sensors
- Delayering & Process
- Die Cross-Section
- Magnetic Concentrator Cross-Section

Comparison with previous generation

Manufacturing Process Flow
> MPU-6500 ASIC Front-End Process
> MPU-6500 MEMS Process Flow
> AK8963 ASIC Front-End Process
> AK8963 Magnetic Concentrator Process Flow
> Wafer Fabrication Units
> Packaging Process Flow & Assembly Unit

 Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> MPU-6500 ASIC Front-End Cost
> MPU-6500 MEMS Front-End Cost
> MPU-6500 MEMS Front-End Cost per process steps
> MPU-6500 Total Front-end Cost
> MPU-6500 Back-End 0 : Probe Test & Dicing
> MPU-6500 Wafer & Die Cost
> AK8963 ASIC Front-End Cost
> AK8963 Magnetic Concentrator Cost
> AK8963 Total Front-end Cost
> AK8963 Back-End 0 : Probe Test & Dicing
> AK8963 Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test & Calibration Cost
> MPU-9250 Component Cost

Estimated Price Analysis



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

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