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iPhone 6s Plus Fingerprint Sensor New Design & Package

3 290 €

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iphone6Sfingerprint flyerFor the iPhone 6s Plus, Apple proposes a new fingerprint with the same detection principle but new design, new front-end process and new back-end packaging.

With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive technology than the previous one, but with important innovations in term of sensor design, die process and packaging.

Integrated in the home button, the 12.5x10.9 mm sensor is incorporated within a rectangular shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected by a sapphire window coated with two different materials and supported by innovative assembly of dies and flex PCB.

The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.

Respect to the old fingerprint sensor, the new sensor is composed of two dies, one dedicated to the sensing and one containing the logic. The ASIC die has a 0.18µm manufacturing process and the sensor die is manufactured with a more recent CMOS 65nm technology. While in the previous sensor had edge cavities for the wire bonding; the new sensor is implemented with TSV which allow a better packaging and wire bonding to the flex PCB.

The report includes comparisons with iPhone 5s fingerprint sensor and with the latest Samsung’s and Huawei’s fingerprints buttons.


iphone6Sfingerprint img
















Table of contents

Overview / Introduction


Company profile & Supply Chain


Physical Analysis

> Physical Analysis Methodology
> Fingerprint Button assembly
  - Home Button Assembly Views
  - Gasket & Flex PCB Removed
  - Fingerprint Sensor
  - Home Button Cross-Section

> Sensor Die

  - View, Dimensions & Marking
  - Sensor Die Capacitors
  - Sensor Die Delayering
  - Sensor Die Bonding & TSV
  - Process & Cross-Section

  - Dimension & Marking
  - Delayering & process identification       
  - Die Cross-Section


Comparison with iPhone 5s fingerprint sensor





















Manufacturing Process Flow

Global Overview
> Sensor Front end and TSV
Sensor 3D Packaging & Process Flow
> ASIC Process

Packaging Process Flow
> Fabrication Unit 


Cost Analysis

Sensor Front end 3D Packaging and TSV cost
> Sensor back end & wafer cost
> Sensor die cost
> ASIC Front end 3D Packaging and TSV cost
> ASIC back end & wafer cost
> ASIC die cost
Sapphire Window Cost
Component Cost & Price


Technology and Cost comparison

with Huawei’s Ascend Mate and Samsung S6

fingerprint sensors




Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here .










  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison of iPhone 5 and iPhone 6s Plus fingerprints

  • Comparison of Apple’s Vs Samsung and Huawei fingerprints