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IRISYS REDEYE-6A Pyroelectric Array Sensor
Jun.2013

graph irisys redeye
2 990 €

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Description

Yole IRISYS REDEYE 6A Thermal Sensor iconeflyerThe REDEYE-6A is a low cost thermal imaging IR sensor
Using a ceramic pyroelectric array
Extracted from the Dewalt DCT416 imaging thermometer


IRISYS (Infrared Integrated Systems Ltd), Northampton, UK, is promoting thermal technology for intelligent building. Using its own thermal imaging cameras, the company has developed a range of innovative solutions from people counting to security.

The REDEYE-6A is an array sensor using pyroelectric ceramic. The manufacturing process is simpler than it is for a micro-bolometer. The ceramic plate is attached on top of the readout integrated circuit and sealed with the IR window.
The definition of the REDEYE-6A is rather low: 31x31 pixels. It is optimized for low-cost application which do not need a great definition and high refresh rate. The same pyroelectric ceramic technology is used for higher definition array sensor, up to 47x47 pixels.

IRISYS has developed a system to compensate the low definition by adding a standard optical sensor and blending the visual and thermal pictures.

The Reverse Costing of the Dewalt DCT416 imaging thermometer is available in a separate report.

 

Graph IRISYS REDEYE

Table of contents

1. Overview / Introduction
> Glossary
> Executive Summary
> Reverse Costing Methodology

2. Company Profile

> IRISYS Profile
> Plessey Semiconductors Profile

3. Physical Analysis

> Synthesis of the Physical Analysis
> IR Camera DCT416
> Package
> IR Window
> Bonding
> Read Out IC
> Principle Operation
> ROIC Functions
> Pixels
> ROIC technology
> Pyroelectric Ceramic
> IRISYS Patents
> Electrodes
> Pyroelectric Ceramic Material
> Physical data summary

4. Manufacturing Process Flow

> Global Overview
> ROIC Process Flow
> Description of the ROIC Wafer
Fabrication Unit
> Pyroelectric Ceramic Process Flow
> Pyroelectric Array Process Flow
> Packaging


 5. Cost Analysis
> Main Steps of Economic Analysis
> Yields Explanation
> Die per wafer & Probe Test
> ROIC Wafer Front-End Cost
> Pyroelectric Ceramic Wafer Cost
> Pyroelectric Array Wafer Cost
> Equipment Cost
> Consumable Cost
> Back-End 1 : Packaging, Final test 
> Component Cost (FE + BE 0 + BE 1) 
> Yields Synthesis

6. Pyroelectric array Price Estimation

> Manufacturer Financial Ratios
> Estimated Manufacturer Price
> Synthesis of the cost analysis
> Contact

 



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