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mCube MC3413 3rd Generation 3-Axis Accelerometer

mcube mc3413 icon
2 990 €

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mCube MC3413 flyerThe First Monolithic 3D MEMS Single-Chip Accelerometer in 1mm²

Despite a large adoption of inertial combo sensors, the discrete accelerometers market is expected to be stable until 2020 thanks to wearable and IoT applications.
mCube, mainly active on the Chinese market and named “MEMS Start-Up of the Year” in 2014, has shipped more than 70 million units and will try to gain market share with new and clever technologies allowing very low manufacturing cost.

Compared to main competitors Bosch Sensortec, STMicroelectronics or InvenSense, mCube is the only provider of a monolithic sensor integration for consumer electronics.
With the mCube approach, the MEMS sensors are fabricated directly on top of IC electronics and connected using TSV (Through-Silicon Vias) in a standard CMOS fabrication facility. The MC3413 is shipped in a 2x2x1mm packaging, but thanks to a new design, this third generation offers a smaller die size compared to previous generation (more than 40% reduction). This very small die size allows it to be incorporated into even smaller packages for space-constrained designs.
The MC3413 is targeted towards the high-resolution marketplace for applications requiring up to 14-bit resolution.
The report includes a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec and STMicroelectronics.

mCube MC3413 img


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison of mCube 3rd generation vs. 2nd generation
  • Comparison of MC3413 vs. latest Bosch & STMicroelectronics Accelerometers

Table of contents

Overview / Introduction

mCube Company Profile

Physical Analysis

> Physical Analysis Methodology
  • Package
  • Package Characteristics Marking & Pin-out
  • Package Opening & Wire Bonding Process
  • Package Cross-Section
> Die
  • Dimensions & Markings
  • Bond Pad Opening
  • MEMS Cap Removed
  • MEMS Cap Details
  • MEMS Sensing Area
  • MEMS Sensing Area Removed
  • Delayering (Metal Layers Removed)
  • IC Process
  • Die Cross-Section

Technology comparison with mCube previous generation and with Bosch Sensortec and STMicroelectronics 3-Axis Accelerometers
Manufacturing Process Flow

> Global Overview
> IC Front-End Process
> MEMS Process Flow
> Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit

Cost Analysis

> Main steps of economic analysis
> Yields Hypotheses
> CMOS Front-End Cost
> MEMS Front-End Cost
> MEMS Front-End Cost per process steps
> Total Front-end Cost
> Back-End 0 : Probe Test & Dicing
> Wafer & Die Cost
> Back-End: Packaging Cost
> Back-End: Packaging Cost per Process Steps
> Back-End: Final Test Cost
> MC3413 Component Cost & Price

Cost & Price comparison with Bosch Sensortec and STMicroelectronics 3-Axis Accelerometers



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