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Melexis MLX90809 Relative Pressure Sensor

3 290 €

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Melexis flyer

Second generation integrated pressure sensor for harsh environment

The MLX90809 is an integrated relative pressure sensor for industrial and automotive application in harsh environment, -40°C to 150°C. The circuit is available with analog or digital (SENT protocol) output and for a pressure between 0 and 1 bar with an accuracy of 1.5%.

It is easy to use with the factory calibration, the full programmation and the integrated analog functions like the voltage regulator. Moreover, the internal diagnostic functions ensure the accuracy of measurement over the time.

 Melexis 2016 low def

Melexis uses a smart packaging easy to integrated in a system and cheap. The relative pressure measurement is using a soft coating rather than a complex packaging with manifolds. The specific coating protects the silicon die while allowing movement of the membrane.


Melexis 2016 3


The MLX90809 is the second generation of integrated relative pressure sensor from Melexis. Melexis has more 10 years’ experience in pressure sensors and more than 20 years in MEMS interface IC.

The report presents a detailed analysis of sensor structure and cost.

 Melexis 2016 2 
















Table of contents

Overview / Introduction

> Executive Summary

> MLX90809


Company profile

> Melexis

> X-Fab


Physical Analysis

> Physical Analysis Methodology
> Package
   - Package Opening

   - Wire Bonding
   - Package Cross-Section
> Pressure sensor Die 
   - Sensor Die View & Dimensions
   - Pressure sensor Views
   - Pressure Sensor Delayering & main Blocs
   - Membrane
   - Piezo-resistors
   - Pressure sensor Cross-Section
   - Sensor Die Process Characteristic






















Sensor Die

> Sensor Die Front-End Process & Fabrication Unit
> Pressure Sensor Die Process 
> Packaging Process & Fabrication unit



Cost Analysis

> Synthesis of the cost analysis
> Main steps of economic analaysis
> Yields Explanation & Hypotheses
> Sensor die
   - CMOS Wafer Front-End Cost
   - Back Side Process Wafer Cost
   - Back Side Process Step Cost
   - Probe Test & Dicing
   - Sensor Die Wafer Cost
   - Sensor Die Cost
> Packaged Component
   - Packaging Cost
   - Back End: Final Test
   - Component Cost


About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.






















































  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation