Second generation integrated pressure sensor for harsh environment
The MLX90809 is an integrated relative pressure sensor for industrial and automotive application in harsh environment, -40°C to 150°C. The circuit is available with analog or digital (SENT protocol) output and for a pressure between 0 and 1 bar with an accuracy of 1.5%.
It is easy to use with the factory calibration, the full programmation and the integrated analog functions like the voltage regulator. Moreover, the internal diagnostic functions ensure the accuracy of measurement over the time.
Melexis uses a smart packaging easy to integrated in a system and cheap. The relative pressure measurement is using a soft coating rather than a complex packaging with manifolds. The specific coating protects the silicon die while allowing movement of the membrane.
The MLX90809 is the second generation of integrated relative pressure sensor from Melexis. Melexis has more 10 years’ experience in pressure sensors and more than 20 years in MEMS interface IC.
The report presents a detailed analysis of sensor structure and cost.
Overview / Introduction
> Executive Summary
> Physical Analysis Methodology> Package - Package Opening
- Wire Bonding - Package Cross-Section> Pressure sensor Die - Sensor Die View & Dimensions - Pressure sensor Views - Pressure Sensor Delayering & main Blocs - Membrane - Piezo-resistors - Pressure sensor Cross-Section - Sensor Die Process Characteristic
> Sensor Die Front-End Process & Fabrication Unit> Pressure Sensor Die Process > Packaging Process & Fabrication unit
> Synthesis of the cost analysis> Main steps of economic analaysis> Yields Explanation & Hypotheses> Sensor die - CMOS Wafer Front-End Cost - Back Side Process Wafer Cost - Back Side Process Step Cost - Probe Test & Dicing - Sensor Die Wafer Cost - Sensor Die Cost> Packaged Component - Packaging Cost - Back End: Final Test - Component Cost
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Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation