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MEMS Packaging
Apr.2012

mems packaging platforms image
5 990 €

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Description

Yole MEMSPackaging 2012The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry.

MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET

In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR)  than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.

There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters &  duplexers, RF switches and MEMS  oscillators: there is no doubt that MEMS content is growing faster than standard IC content.

Mems packaging platforms image


CHANGING THE PARADIGM

In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged module’s cost. 
MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.

The application scope of MEMS is broad and very diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with NO manufacturing standards clearly emerging. Packaging always needed to cope with the very specific end-applications requirements of MEMS modules.
However, the MEMS law “One MEMS  =  1 Device  with  1 Process  with  1 Package” is now changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for e.g.)

This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.

Key elements

STANDARDS ARE ON THE WAY

While there are a lot of developments happening for high reliability, low cost MEMS packages in the automotive, medical and industrial application space, the number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket, driving integration of an incredibly high number of MEMS and sensor devices in unprecedented volume. As a result, OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying several key trend in this space:
  • IDMs needs to find second sources partners and qualify some OSATs in order to secure their supply chain
  • Standardization (coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, test and calibration cost of MEMS modules under control.
More than ever, system-level integration (including package co-design & software competencies, SiP module assembly, passive integration and 3D TSV / WLP capabilities) will be key to leverage a high added value solution to final OEM customers as well as an efficient infrastructure to support the high volume grow of consumer MEMS applications. There are many different players with different designs, and it’s not likely we’ll see one solution adopted by all the players. Expect to see a blooming of several “big niches” standards in the future, driven by the biggest and most successful players.

Table of contents

Introduction to MEMS industry 8
Applications, players and market dynamics

Executive Summary 21
Global MEMS packaging  2010-2016 market  forecast 40
> Overall MEMS package shipments forecast (in units)
> Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…
> Global MEMS package, assembly & test value (in M$)
> Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…

Supply & value chain for MEMS Packaging 80
> MEMS module packaging
- Key manufacturing steps
- Who is doing what?
- Main key business models

> MEMS packaging supply chain
- Example of supply chains for several case examples
- Overall supply chain with links between major key players
> MEMS packaging industry value chain analysis
> ‘Captive’ versus ‘outsourced’ strategy trends for MEMS packaging, assembly, test & calibration

Application focus for MEMS packaging 99
> Silicon microphones
- Key players & market shares
- Teardowns module analysis
- Packaging, assembly & test specificities
- Cost structure analysis (MEMS / ASIC, module assembly & Test)
- Supply chain & infrastructure
- Packaging roadmaps & perspectives
> Accelerometers
> Gyroscopes
> Magnetometers
> Motion sensor Combos & IMUs
> Pressure-sensors & TPMS
> Oscillators & resonators
> FBAR / BAW filters
> SAW filters
> Micro-mirrors
> Micro-bolometers
> Ink-jet MEMS modules
> Microfluidic packaging
> Emerging MEMS (switches, µdisplays)  

MEMS testing & calibration trends 257
> Focus on MEMS wafer testing
> Focus on MEMS final test & calibration
Conclusions & Perspectives p.288
Appendix 294
> Acronyms & Definitions
> Yole Developpement presentation

LIST OF FIGURES

> 2010-2016 MEMS market forecast shipments by applications (in Munits)
> 2010-2016 MEMS market value forecast evolution by industry (in M$) 
> 2010-2016 MEMS market forecast by applications (in USM$ revenues)
> MEMS market value 2011 versus 2017 breakdown by application (in M$) 
> 2011 MEMS Ranking in $M – TOP 30 players
> 2011 MEMS Ranking in $M – TOP 30 to 70 players
> TOP 30 MEMS players ranking by Business Model
> 2011 MEMS Foundries Ranking 
> MEMS Packages versus IC Packages Shipment forecast (in Munits)
> MEMS Packaging versus IC Packaging Market forecast (in BUS$, including Final Test value)
> 2010 MEMS Packaging assembly trends (in Munit shipments)
> 2010 MEMS Packaging platform assembly trends in Munit shipments)
> 2010 MEMS Packaging, Assembly, Final Test & Calibration market breakdown by applications
> 2010-2016 MEMS Packaging, Assembly, Final Test & Calibration value forecast breakdown by applications (in MUS$)
> 2010-2016 MEMS packaging & assembly value forecast breakdown by applications (in MUS$)
> 2010-2016 MEMS packaging Final Test & Calibration value forecast breakdown by applications (in MUS$)
> 2010 ASIC-to-MEMS integration trends Breakdown in Munits (SiP integration / SOC single die)
> 2010 MEMS first-Level Packaging Breakdown by technology (no 1st level /WLCapping / Thin-film packaging)
> 2010 MEMS interconnect assembly Trends breakdown (Wire-bond / flip-chip / WLCSP / 3D TSV)
> 2010 MEMS Substrates business (in MUS$) Breakdown per category (ceramic / leadframe / organic laminate / Glass&Silicon) 
> 2010 Organic laminate substrate for MEMS applications - Value Breakdown
> 2010 Leadframe substrates for MEMS applications - Value Breakdown
> 2010 Ceramic substrate market for MEMS applications - Value Breakdown
> 2010 Glass/Silicon 2.5D interposer substrates for MEMS applications - Value Breakdown
> 2010 MEMS Encapsulation/Sealing/Protection - Trends Breakdown in Munits
> 2010 MEMS packaging, assembly, test & calibration trends- ‘captive’ versus ‘outsourced’ strategy
> 2010 – 2016 MEMS packaging, assembly, test & calibration activity ‘captive’ versus ‘outsourced’ strategy trends
> 2010 MEMS packaging value chain Representative view of business model’s intersections

Companies Cited

AAC Acoustic Technologies
Aichi MI
AKM
Akustica
Amkor
Analog Devices
ASE
Avago Technologies
bTendo
Bosch
Carsem
Canon
China WLCSP
Colibrys
DALSA / Teledyne
DelfMEMS
Denso
Discera
DRS
Epcos – TDK
EPWorks
FLIR Systems
Freescale
Fujifilm Dimatix
Fujikura
GE Sensing
Goodrich-AIS
Hana Microelectronics
Honeywell
Hosiden
HP
Infineon
Invensense
Ion Torrent
JCAP
J-Devices
Kionix
Knowles Electronics
KYEC
Kyocera
Lemoptix
Lexmark
Lingsen
MEM Hitech
Melexis
MEMJET
MEMSiC
Microvision
Miradin
Murata
NEC / Schott
Oak-Mitsui
NXP Semiconductor
Olympus
Omron
Panasonic
PlanOptik
PoLight
Pyreos
Qualcomm MEMS Technologies
Raytheon
Rohm
Rood Microtec
Sand9 
Sencio
Seiko-Epson
Sensata
Sensonor
Sensor Dynamics
Shinko
SiTime
Silex Microsystems
Silicon Sensing Systems
Sony
SPIL
StatsChipPAC
STMicroelectronics
Systron Donner Inertial
Taiyo-Yuden
Tecnisco
Teramikros
Texas Instruments
Tong Hsing Electronics
Triquint Semiconductor
Tronics Microsytems
TSMC
ULIS
Unimicron
Unisem
UTAC
VTI Technologies
WiSOL
Wispry
X-Fab
Xintec
Yamaha… 

 

KEY FEATURES OF THE REPORT

  • Market data on key MEMS packaging industry market metrics & dynamics
  • Technical insight about key MEMS packaging technology trends & challenges
  • Deep understanding of the MEMS packaging value chain, infrastructure & players