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Nokia Lumia 920 - Camera Module with OIS
Apr.2013

camera module cost breakdown nokia lumia 920
2 990 €

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Description

Yole RP119 Nokia Lumia 920 Camera Module iconeflyerThe first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology

While Digital Still Cameras commonly use optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.

To performs Optical Image Stabilization, the camera module includes a floating lens technology which consists in moving the 5-elements lens module in perfect synchronization with the camera movement.

Component Nokia Lumia 920


The camera movement is measured with a dual-core 3-axis gyroscope from STMicroelectronics included in the camera module. Instead of using two dedicated sensors, Nokia chose to integrate a single gyroscope for both gesture recognition and camera image stabilization, allowing cost and board space savings.

The camera module of the Nokia Lumia 920 also provides true 16:9/4:3 aspect ratios by the use of a custom CMOS Image Sensor (CIS) manufactured by Sony. The CIS features a 8.7 megapixel resolution, 1.4µm pixel size, and uses a Back-Side Illuminated (BSI) technology.

 

Camera module cost breakdown Nokia Lumia 920

 


This report provides a complete teardown of the camera module with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

Table of contents

Glossary
Overview/Introduction
CMOS Image Sensor Market
Nokia Lumia 920 Teardown
Physical Analysis
> Physical Analysis Methodology
> Camera Module with flex
> Camera Module Views & Dimensions
> Camera Module X-Ray
> Camera Module Disassembly
> CIS Views & Dimensions
> CIS Resolutions
> CIS Pads
> CIS without Microlenses
> CIS Pixels
> CIS Technology node
> CIS Memory
> Camera Module Cross-sections
- Housings
- PCB
- Lenses
- Auto-focus actuator/OIS
- IR FIlter
> CIS Cross-sections

Manufacturing Process Flow

> Global Overview
> CIS Process Flow
> BSI Detailed Process Flow
> Description of the CIS Wafer Fabrication Unit


 Cost Analysis
> Synthesis of the Cost Analysis
> Main Steps of Economic Analysis
> Supply Chain
> Yields Hypotheses
> CIS Front-End : Hypotheses 
> CIS FEOL + BEOL Cost
> CSI BSI Cost
> CIS BSI Cost per Process Steps
> CIS BSI : Equipment Cost per Family
> CIS BSI : Material Cost per Family
> CIS Front-End Cost
> CIS Back-End 0 : Test & Dicing 
> CIS Wafer Cost (Front-End + Back-End 0)
> CIS Die Cost & Price
> Camera Module Assembly - Hypotheses
> Lens Module Cost
> Auto-Focus Actuator / OIS Cost
> Main ICs and IR Filter Cost
> Final Assembly Cost
> Camera Module Cost

 



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Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

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− Custom reverse costing analyses: technology analysis followed by cost evaluation
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− Packaging including wafer level
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Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

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