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Oppo Find X Teardown and Identification of Key Components

1 990 €

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SP18417 Intel EMIB flyer cover

Discover key devices used by Oppo for its first European smartphone market entry.


The Oppo Find-X smartphone hit the shelves of the European market for the first time this fall. To make an impact in this new market, Oppo has been very innovative by including a sliding element, facial recognition and a curved, bezel-less, cutout-free Active Matrix Organic Light Emitting Diode (AMOLED) display, and other features.

Through a teardown of the Oppo Find-X, this report describes the main Integrated Circuits (ICs) from the main boards.


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It identifies the manufacturers, the different packaging sizes, types and pitches as well as the function of the main chipset.

A physical analysis of the main substrates highlights internal structures and technologies used for the Printed Circuit Boards (PCBs).

The report includes teardown photos, detailed package identifications and descriptions and is supplied with an Excel file summarizing the Oppo Find-X chipset and the distributions by supplier, packages and footprint.


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Table of contents


> Executive Summary



Physical Analysis

> Views and dimensions of the Oppo Find X
> Teardown
> Electronic boards high definition photos
> Main component markings and package identification: type, dimensions, pitch, pin count
> PCB surface area, cross sections and minimum line width
> IC package distribution
> IC manufacturer design wins
> IC package footprint










































































About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Smartphone teardown

  • Integrated circuits identification, including marking, manufacturer, reference,function, package type, size and pin count

  • Printed circuit board characteristics, including cross-section and minimum line width

  • Distribution graphs