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Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
Nov.2018

sp18434-_oppo_find_x_3d_facial_recognition_image1
3 990 €

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Description

SP18430 Wafer Bonding Comparison 2018 flyer yole cover

The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.

Last year, ahead of its competitors, Apple introduced front 3D depth sensing in its flagship model, the iPhone X. Following this trend, Chinese players like Vivo, Xiaomi, Huawei and Oppo also decided to integrate such modules, providing new features for security or entertainment in their flagships. For the first Oppo smartphone sold in Europe, the Find X, Orbbec has been chosen to provide the complete 3D solution. Working together with a custom system-on-ship (SoC) and a global shutter (GS) near infrared (NIR) camera module, the dot projector is the first to use a camera module assembly configuration for structured light illumination.

 

SP18434 Oppo Find X 3D Facial Recognition image1

 

Located in the Find X’s front side, around the speaker, the 3D system is packaged in one metal enclosure. The system features a dot projector, a flood illuminator, a red/green/blue camera and a NIR camera sensor. An additional SoC component is soldered on the main board to process the signal from the latter devices.

The system uses standard components found on the market. That includes a GS image sensor featuring 3µm size pixels and standard resolution of 1 megapixel and a vertical cavity surface emitting laser (VCSEL). The system is therefore very cost efficient compared to other solutions. The camera and dot projector module assembly uses standard wire bonding to connect the sensor or the VCSEL dies, along with an optical module comprising four lenses for both modules.

This report analyzes the complete 3D depth sensing system, including a complete analysis of the NIR camera module, the dot projector and the SoC, along with cost analysis and price estimation for the system. It also includes a physical and technical comparison with other 3D sensing systems, such as those from Apple in the iPhone X. The comparison looks at system integration, the NIR camera module and the dot projector architecture.

 

  SP18434 Oppo Find X 3D Facial Recognition image4 SP18434 Oppo Find X 3D Facial Recognition image2 SP18434 Oppo Find X 3D Facial Recognition image3

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Introduction


 

Company Profile


  

Oppo Find X – Teardown


 

Market Analysis


 

Physical Analysis


> Physical Analysis Methodology

> NIR Camera Module Disassembly and Cross-Section

> Sensor Die

- View, dimensions, pixels, pads, markings, die process and cross-section

> DOT Projector Module Disassembly and Cross-Section

> NIR VCSEL Die

- View, dimensions, die process and cross-section

> Orbbec MX6300B – Component Analysis

- Package/die view and dimensions

- Die delayering, main block IDs and structural blocks

- Die process and cross-section

> Physical Data Summary

 

 

 

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Physical Comparison: Apple iPhone X


> System Integration

> NIR Camera Module and Sensor

> Dot Projector Module and VCSEL

 

 

Manufacturing Process Flow


> Die Fabrication Unit : NIR Image Sensor, NIR VCSEL, Orbbec SoC

> NIR VCSEL Process Flow

 

 

Cost Analysis


> Cost Analysis Overview

> Supply Chain Description and Yield Hypotheses

> NIR Image Camera Module Cost

- Front-end (FE), microlens and total FE cost

- Wafer and die cost

- Lens module and assembly cost

> NIR VCSEL Die Cost

- Front-end (FE), wafer and die cost

- Front-end cost per process steps

- Lens module and assembly cost

> SoC Die Cost

- Front-end (FE), wafer and die cost

- Packaging and component cost

  

 

Estimated Price Analysis: NIR Camera Module, DOT Projector Module, SoC and Optical Hub


 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Materials analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Comparison with Apple iPhone X 3D sensing solution