Reverse engineering and costing of the new inFO packaging technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7 and 7 Plus
Reverse engineering and costing of the new Integrated Passive Device technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7
Comparison of both Samsung Galaxy S7 processor packages: Qualcomm Snapdragon 820 MSM8996 with MCeP packaging technology vs. Samsung Exynos 8 with TMV Package-on-Package