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Panasonic 600V GaN HEMT PGA26E19BA

3 290 €

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Panasonic PGA26E19BA 600V GaN HEMT flyer

Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure

System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance.

Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component. 

The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.

Panasonic 600V GaN HEMT PGA26E19BA System Plus Consulting 2017

The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters. The GaN and AlGaN layers are deposited by epitaxy onto a silicon substrate. A complex buffer and template layer structure is used to reduce the stress and dislocation levels.

Based on a complete teardown analysis, the report provides an estimation of the production cost of the epitaxy, HEMT and package. Moreover, the report compares the new device with GaN Systems’ GS66504B and Transphorm’s GaN HEMT. This comparison highlights the huge differences in design and manufacturing processes and their impact on device size and production cost.


Panasonic 600V GaN HEMT PGA26E19BA System Plus Consulting 2017 3

          Panasonic 600V GaN HEMT PGA26E19BA System Plus Consulting













Table of contents

Overview / Introduction

Executive Summary
Reverse Costing Methodology



Company Profile




Physical Analysis

Overview of the Physical Analysis
Package Analysis
> Package opening
> Package cross-section


> HEMT die view and dimensions
> HEMT die process
> HEMT die cross-section
> HEMT die process characteristics



HEMT Manufacturing Process

HEMT Die Front-End Process
HEMT Die Fabrication Unit
Final Test and Packaging Fabrication Unit




























Cost Analysis

Overview of the Cost Analysis
Yield Explanations and Hypotheses
HEMT die
> HEMT die front-end cost
> HEMT die probe test, thinning and dicing
> HEMT wafer cost
> HEMT die cost


Complete HEMT
> Packaging cost
> Final test cost
> Component cost


Price Analysis

Estimation of Selling Price




Comparison Between Panasonic HEMTs

Comparison Between Panasonic, Transphorm and GaN Systems HEMTs




About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.


Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.


System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.


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  •  Detailed photos and identification

  • SEM and EDX analysis of epitaxy layers and transistor structure

  • Manufacturing process flow 

  • In-depth economic analysis

  • Manufacturing cost breakdown

  • Selling price estimation

  • Comparison with Panasonic’s TO220 device

  • Comparison with Transphorm and GaN Systems devices