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Polymeric Materials for 3DIC & WLP Applications
May.2012

wlp applications platform covered
5 990 €

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Description

Yole Polymeric Materials 2012The first complete report analyzing in detail the  opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications

POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS

Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by:

  • the expansion of flip-chip wafer bumping
  • Fan-in WLCSP packages
  • 3D WLP, FO WLP packages
  • 2.5D Glass / Silicon interposers
  • 3DIC  packages


Yole analysts have gathered market data, technology information and analysis necessary to answer the following questions:

  • What materials are being used in what applications ?
  • What key properties do I need to understand before I make a material choice ?
  • Who are the key supplies of these materials  and what is their market share?
  • What synergies do competitors have in their product lines ?

polymeric forecast

AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS 

About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.

Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps. 

PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.

WLP Dielectric revenues
This research will cover :

  • Global materials market forecast
  • Global forecast  breakdown by application
  • Global forecast  breakdown by function
  • Detailed market breakdown of permanent dielectrics by material, supplier, account

A WIDE RANGE OF POLYMERIC MATERIALS ARE USED TO SOLVE WLP ISSUES


poymeric properties
There is a wide range of polymeric material available on the market. This study will feature:

  • Chemistries  and history of key microelectronic polymers
  • Properties, pros & cons for each solution
  • Applications by polymer type
  • Processing considerations

NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET

Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow,  significant demand will shift to FOWLP, 3DIC stacks,  3D WLP, and 2.5D interposer substrate platforms.


WLP applications platform covered
Types of polymeric materials covered:

  • Permanent dielectric polymers
  • Thick plating resists
  • Temporary bonding & de-bonding adhesives
  • Hard mask resist for DRIE etch
  • Wafer-level underfills
  • Wafer-level molding compounds
  • Adhesive tape (BG/Dicing tape)

Table of contents

Scope of the report 4


Executive summary 10


Key Properties of Polymeric materials 22


> Electrical properties

> Mechanical properties

> Thermal properties

> Others properties

> Comparison of polymer properties

Commercial Microelectronic Polymer Chemistries 62


> Epoxies

> Polyimides

> Polybenzoxozoles (PBO)

> BCB

> Siloxanes   

> Parylène   

> Polynorbornenes

> AL-X aromatic fluoropolymer

Polymeric materials for Wafer Level Packaging Functions Applications 111


> Permanent dielectric polymers

> Strippable plating resists   

> Temporary bonding & de-bonding adhesives

> Hard mask thick resist for DRIE

> Wafer-level underfills

> Wafer-level molding compounds

Permanent Dielectric -Material Processing Considerations 199


> Wafer-level molding compounds

> Spin-coating

> Spray-coating

> Other depositions

> Lithography (Expose & Develop)

> Curing / Descum

> Stripping / cleaning

Mid-End / WLP Application platforms 237


> Flip-chip wafer bumping

> ‘Fan-in’ WL CSP

> FO WLP

> 3D WLP

> 3D IC with TSV

> 2.5 silicon interposers

> Passive integration – Thin-film IPD

Market size by Material / Application / Supply chain 280


> WLP materials market forecast for WLP applications
- 2011-2016 Global Materials Market Forecast

> 2011-2016 Global Materials market forecast breakdown
- 2010-2016 Polymer materials forecast breakdown by materials functions

> Dielectric passivation polymers: details market forecast

- WLP cost breakdown per material supplier 2011

- WLP cost breakdown by polymer type 2011

- Polymer market share per supplier

- Demand by player breakdown by application per player

Polymeric material suppliers – Company  profiles 321


Conclusions & perspectives


Appendix 439


Companies Cited

3M
Ajinomoto
Asahi Glass
Asahi Kasei
Brewer Science
Cookson
Dow Chemical
Dow Corning
DuPont
HD Microsystems
Fujifilm
Hitachi Chemical
Henkel
JSR Micro
Lord
Namics
Nitto Denko
Nippon Kayaku
Shin Etsu
Silecs
Simitomo Bakeite
TOK and Toray.

 

KEY FEATURES OF THE REPORT

All applications of GaAs wafer and market metrics, detailing:

  • Market data, technology information and analysis
  • Global materials market forecasts (by application, by function, of permanent dielectrics by material, supplier, account)
  • Key features of a wide range of polymeric material available on the market
  • Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties of these products are compared and contrasted [/features]