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Qualcomm WCD9335 Fan-Out WLP Audio Codec

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Qualcomm Fan Out flyer

Qualcomm’s Fan-Out Wafer-Level Package Chip Audio Codec in eWLB Package inside Samsung Galaxy S7 and S7 Edge

Qualcomm, a world leader in mobile technologies, offers the new Snapdragon 820, a complete chipset currently powering or in-development with more than 100 smartphones worldwide. The U.S. versions of Samsung’s latest flagship phones, the Galaxy S7 and Galaxy S7 Edge, integrate the

Snapdragon 820 chipset. In this chipset, we discovered for the first time a Qualcomm component featuring Fan-Out Wafer-Level Packaging (FOWLP): the Qualcomm Audio Codec WCD9335.

Located on the smartphone’s main board, the audio codec chip’s presence in the Samsung Galaxy S7 and S7 Edge depends on the smartphone version.  The international version, featuring an Exynos chipset, integrates the audio codec chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset, integrates the audio codec from Qualcomm.

The Qualcomm WDC9335 is wafer-level packaged with fan-out technology. This is still relatively rare in the smartphone market but is expected to spread quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to several OSATs including ASE Group, Nanium, and STATS ChipPAC.

Thanks to this FOWLP process, Qualcomm is able to propose a very small die independent of the area required by the I/O pads. The result is a very cost-effective component that can compete with a standard fan-in WLP technology.

This report includes a comparison with the audio codec solution from Cirrus Logic for the international version, which uses a standard fan-in WLP technology. It also features comparisons with FOWLP technologies like RCP from NXP/nepes, and eWLB 1st-generation from Infineon.

 Qualcomm Fan Out img


















Table of contents

Overview / Introduction


Company profile & Supply Chain


Physical Analysis

> Samsung Galaxy S7 Teardown
    - Component removal
> Fan-Out Packaging Analysis
    - Package view, dimensions & marking
    - Fan-out package cross-section
    - Fan-out package process
> Die Analysis
    - Die view, dimensions & marking
    - Die cross-section
    - Die process


Manufacturing Process Flow

> Chip Fabrication unit

> eWLB Fabrication unit

> eWLB Process Process













































Cost Analysis

> Synthesis of the Cost Analysis
> Die Cost Analysis
    - Wafer front-end cost
    - Probe test cost
    - Die cost
> eWLB Cost Analysis
    - eWLB wafer cost
    - eWLB cost per process step
> Component Cost


Cost Analysis Simulation Without eWLB Packaging

> Die cost
> WLP package cost
> Component cost comparison


Estimated Price Analysis

> Manufacturer Financial Ratios
> Estimated Sales Price


Technology and Cost Comparison with Infineon’s eWLB and NXP’s RCP



About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.















































  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price

  • Comparison with Cirrus Fan-In WLP Audio Codec in Samsung S7 European Version

  • Comparison with Intel/Infineon’s eWLB & NXP/nepes RCP