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Seek Thermal Infrared Camera & Raytheon IR Microbolometer

seek thermal
3 490 €

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Icone Seek Thermal Infrared Camera and Raytheon IR Microbolometer FlyerThe highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS.

Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and  a fabless structure, Raytheon enters in the consumer market.

The Seek Thermal camera has a very compact size and is compatible with Android smartphones via its micro-USB connector. The camera performs its calibration automatically thanks to an electromechanical shutter assembled on the electronic board. The device also includes a chalcogenide lens inserted in a zinc lens housing.

The thermal camera uses a new 12µm pixel design from Raytheon.  The EXC001 microbolometer, is featuring a 206x156 pixels resolution, 6 times the resolution of the FLIR One. The sensor technology in the Raytheon component is an uncooled VOx microbolometer and a 2 levels structure. Thanks to its strong integration at the die level with a wafer-level packaging (WLP), this is the world's smallest microbolometer-based thermal imaging camera die.

Based on a complete teardown analysis of the Seek Thermal Camera and the Raytheon microbolometer, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.

At last, a characteristics comparison between Flir One and Seek Thermal Cameras highlights differences in  technical choices made by both companies.

   Seek Thermal         Seek Thermal image2         Seek Thermal image3


  •  Camera teardown
  •  Flir One and Seek Thermal comparison
  •  Bill of Material
  •  Module Detailed Photos
  •  Precise Measurements
  •  Material Analysis
  •  Manufacturing Process Flow
  •  Supply Chain Evaluation
  •  Manufacturing Cost Analysis
  •  Selling Price Estimation

Table of contents

(62 pages)

Overview/Introduction, Main Features

Flir One and Seek Thermal comparison


Views and Dimensions of the Housing
Seek Thermal Camera Disassembly
Shutter Module
Lens Module
Electronic Board
High Definition Photos & PCB Markings
Components Markings & Identification

Cost Analysis

Accessing the BOM
Estimation of the cost of the PCB
BOM Cost – Electronic Board, Housing and Packaging
Material Cost Breakdown
Accessing the Added Value (AV) Cost
Electronic Board Manufacturing Flow & AV Cost
Housing & Packaging Assembly AV Cost
Added Value Cost Breakdown
Estimation of the Manufacturing Price
EXC001 Infrared Camera Module
(104 pages)

Overview/Introduction, Company Profiles, Main Features

Flir One and Seek Thermal comparison

Physical Analysis

EXC001 Microbolometer
View & Dimensions
Disassembly & Cross-Section
Infrared Sensor
Microbolometer & ROIC Views & Dimensions
Pixel Details, Delayering
Cross-Section & Process Characteristics

Manufacturing Process Flow

ROIC Process & Microbolometer Process Flow
Wafer Fabrication Unit

Cost Analysis

Yield Hypotheses
ROIC & Microbolometer Wafer & Die Cost
ASIC Wafer & Die Cost
EXC001 die Cost & Price



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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