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Sensonor STIM210 High-precision MEMS Gyro Module

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4 490 €

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SC Sensonor 2014World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.

MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.

STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

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Table of contents

1. Overview/Introduction
2. Company Profile
3. Physical Analysis
> Module
- Views, Dimensions & Pin-out
- Opening
> Electronic Board
- Components Markings
- Components Identification
- Bare Dies Connections
- View, Dimensions & Marking
- Delayering, Process Identification
- Cross-Section
> MEMS Gyro
- View, Dimensions & Marking
- Bond Pads & Bond Pads Opening
- MEMS Cap Removed
- MEMS Sensing Area
- MEMS Gyro Principle
- MEMS Cross-Section: Masses
- MEMS Cross-Section: Electrode
- MEMS Cross-Section: Buried Connections
- MEMS Cross-Section: Getter

4. Manufacturing Process Flow

> Global Overview
> ASICs Front-End Processes & Wafer Fab Units
> MEMS Process Flow & Wafer Fab Unit
> Module Assembly Process Flow & Assembly Unit

 5. Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> ASICs Cost
- Front-End Cost
- Probe Test & Dicing Cost
- Wafer & Die Cost
> MEMS Gyro Cost
- Front-End Cost
- Front-End Cost per process steps
- Probe Test & Dicing Cost
- Wafer & Die Cost
> BOM Cost
- Electronic Board BOM Cost
- Housing BOM Cost
- Material Cost Breakdown
> Module Assembly & Test Cost
- Electronic Board Assembly Cost
- Housing Assembly Cost
- Final Test & Calibration Cost
> STIM210 Module Cost & Estimated Price



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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