The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
Boasting an innovative design based on metal oxide technology, the SGP30 is Sensirion’s first multi-gas sensor. Enclosed in a small DFN 2.45 x 2.45 mm molded package, this sensor can be embedded in virtually any low-power system. Sensirion’s “Multi-Pixel” technology focuses on detecting different gases like CO2 and VOCs on a common membrane, using multiple metal-oxide in the same component.
To reduce the component size, Sensirion placed the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the SGP30 embeds the heater and electrodes within the ASIC. Despite the high current and temperature generated, signal measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a temperature sensor for measuring the membrane’s temperature, along with flash memory for data calibration.
This report analyzes Sensirion’s entire component, including the package, MEMS, and ASIC die developed by the company. It also provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used.
A complete cost analysis and estimated sales price for the SGP30 gas sensor is included too, along with a comparison between ams’ AS-MLV-P2, ams's CCS801 and Bosch’s BME680 gas sensor.
Overview / Introduction
Sensirion - Company Profile
> Physical Analysis Methodology> Sensor Package- View and dimensions- Package Opening- Sensor Package Cross-Section> MEMS/ASIC Die- View, Dimensions, and Markings- Cross-Section: Metal Layers, Transistor, - Capacitor- Die Metal De-processing- Die Delayering, Main Block ID, and Process- Die-Process Characteristics> Comparison with ams and Bosch
Manufacturing Process Flow
> Wafer Fabrication Unit> Front-End Process> Final Assembly Unit
> Cost Analysis Overview> Main Steps Used in the Economic Analysis> Yield Hypotheses> ASIC- Front-End Cost> MEMS- Front-End Cost> Back-End Cost> Packaging Cost> Component Cost
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Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Comparison with ams and Bosch gas sensors