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Silicon Labs CMEMS Oscillator
Jan.2014

silicon labs cmems oscillator photo
2 990 €

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Description

Yole Silicon Labs CMEMS Oscillator IconeFlyer.jpgFirst fully integrated, monolithic CMOS+MEMS oscillator device

Innovative Poly-SiGe Surface-Micromachining Process

The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets.

The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators.

CMEMS process consists in a monolithic integration of a CMOS circuit with innovative Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures manufactured directly above CMOS metallization.

The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process.

With a die size below 1mm², the Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market.

This report will provide a complete teardown of the MEMS oscillator with:

Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth manufacturing cost analysis
Supply chain evaluation
Selling price estimation

Silicon Labs CMEMS Oscillator photo

Table of contents

Glossary
Overview/Introduction
> Executive Summary
> Reverse Costing Methodology


Silicon Labs Company Profile

> Silicon Labs Profile
> Si504 Characteristics

Physical Analysis

> Physical Analysis Methodology
> Package
- Package View, Dimensions & Pin-out
- Package X-Ray
- Package Opening
- Package Cross-Section
> Die
- View, Dimensions & Marking
- MEMS Cap Removed
- MEMS Cap Details
- MEMS Resonator Structure
- CMEMS Delayering & IC Process
- MEMS Cap Cross-Section
- CMEMS Cross-Section
- IC Layers
- MEMS Layers

Manufacturing Process Flow

> Global Overview
> CMOS Front-End Process
> MEMS Resonator Process Flow
> MEMS Cap & Assembly Process Flow
> Wafer Fabrication Unit
> Packaging Process Flow & Assembly Unit


 Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> CMOS Front-End Cost
> MEMS Resonator Front-End Cost
> MEMS Cap Front-End Cost
> CMEMS/Cap Assembly Cost
> MEMS Front-End Cost per process steps
> MEMS Front-End: Equipment Cost per Family
> MEMS Front-End: Material Cost per Family
> Total Front-end Cost & Price
> Back-End 0 : Probe Test & Dicing
> Wafer & Die Cost
> Back-End : Packaging & Final Test Cost
> Si504 Component Cost

Estimated Price Analysis

> Silicon Labs Financial Ratios
> Si504 Estimated Price

 



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Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

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We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
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System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
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Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

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