Description Growth is back - New technologies are finding their way to implementation - The supply chain is being reshaped by M&A and vertical integration.The power electronics market has been relaunched after two years of stagnancy
Last year, 2014, was a year of recovery for the power electronics market. After two tough years without seeing any growth, in 2014 the market’s size increased by 8.4%, reaching $11.5B for power semiconductor devices. The outlook for the years ahead is also optimistic. Market growth will be driven by a significant increase in electric and hybrid vehicle (EV/HEV) sales, as well as the ramp-up of renewable energy and more smart-grid technology implementation. The market will surpass $17B by 2020, representing a compound annual growth rate (CAGR) of 6.9% for the period 2014-2020.
Power modules, and more precisely IGBTs, will lead this growth. Modules are expected to reach a CAGR 2014-2020 of 10.3%, compared to 5.1% growth for discrete components. This growth in the demand of IGBT modules is due to their improved overall performance in terms of efficiency and thermal conductivity management. The new wide band gap device market will also drive growth, representing around 5% of the overall market by 2020, even though in terms of units their presence will still be limited.
This report presents data for different applications such as photovoltaics (PV), wind turbines, transmission and distribution, EV/HEV, rail traction, uninterruptible power supplies and motor drives, as well as from different value chain levels, covering wafers, devices, and inverters.
Chinese companies’ vertical integration is challenging diverse historical market leaders, while Europe & US companies are pushing horizontal integration
In this context the supply chain is evolving. The power electronics supply chain is very diverse and mostly application- and local market-dependent. European and American players will prioritize horizontal integration, keeping proven expertise in a specific level of the value chain. Therefore, partnerships and joint-ventures will be preferred. This report analyzes the major mergers and acquisitions of 2014, for instance International Rectifier’s acquisition by Infineon, in order to understand their context and purpose.
Some system manufacturers, such as Tesla or BYD, have understood the importance of developing their own power electronics and energy management systems for traction, chargers and batteries in order to offer extended added-value.
Asian companies will prefer to expand vertically in order to be fully integrated and optimize the costs. Japanese players are already vertically integrated and involved in multiple applications simultaneously to benefit from their technologies across different markets. Chinese players are developing this vertical integration in order to create major market leaders in each application segment such as SunGrow in PV, GoldWind in wind and BYD in EV/HEV. This report focusses especially on the details of the Chinese market, which is driven by Chinese Government policies. In this changing environment, western and Japanese players need to bring high added-value solutions to be able to compete with Chinese companies. The report includes a complete section on main players’ strategies.
Existing technological disruptions are now generating revenues and becoming a challenge for companies that are not involved
The demand for compact products is increasing. Therefore, players are obliged to create partnerships between different industries in order to coordinate and use the synergies of integrated products to offer a smaller and higher-performance solution. Yole Développment has described several partnerships influenced by this trend. In this direction, the concept of the power stack has recently appeared and ever more companies will take part in their development.
Technologically, MOSFETs and IGBTs are and will continue to be the devices in greatest demand, covering low and medium-high voltage applications respectively. New technologies have appeared in the last decade, such as Super Junction MOSFETs, which have brought the MOSFET family into higher voltage segments up to 900V, with better performance. In terms of power packaging, ongoing evolution is driven particularly by the EV/HEV industry.
The charge of new wide band gap (WBG) materials is also reshaping the power electronics industry. Silicon carbide (SiC) and gallium nitride (GaN)-based devices are intended for high voltage - especially SiC - high frequency and high temperature applications thanks to their advanced performance compared to silicon devices. SiC technology is more mature than GaN, and so industry segments such as the rail traction and PV inverters have already launched their WBG device systems based on it.
The introduction of SiC into other high voltage segments, such as wind and high-voltage direct current grids is also inevitable. But the big boost for these new markets should arrive with the implementation of SiC devices in electric cars’ traction systems. GaN systems are still less present on the market. Some consumer applications, such as laptop chargers, and just-announced PV inverters are going to be the first segments incorporating GaN. Several system manufacturers are also developing further SiC and/or GaN device-based prototypes and thus the next 5 years are going to be decisive for WBG devices’ introduction into different markets.
- Power module and discrete component packaging analysis
- Major M&As of 2014 and their context
- Analysis of the supply chain trends in Chinese and Western markets
- Have a clear overview of the entire power electronics value chain
- Access the market for silicon, wafer, device, module, inverter manufacturers
- Understand the main technologies in power electronics
- Understand the market dynamics for the related power electronics applications
- Identify the key drivers that are reshaping the supply chain
- Understand the vertical and horizontal integration activities, as well as discovering different competitive landscapes and geographical specificities.