Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
Overview / Introduction
Taiyo Yuden Company profile
Huawei Mate 9 Pro Teardown
> Physical Analysis Methodology> Package - View and dimensions- Package opening - Package cross-section> SAW Filter - View, dimensions and markings- IDT and reflector- Cross-section: substrate, pads, IDT> BAW Filter - View, dimensions and markings- Die overview: pads, apertures, FBAR cells, frequency control features, equivalent circuit, - Cross-section: substrate, pads, FBAR shunt and series cells> Physical Data Summary
Physical Comparison with previous duplexer generation
> Package, Schematics, Design
Physical Comparison with Broadcom and Qorvo
> Package, BAW Technology
Manufacturing Process Flow
> Filter Process> Filter Wafer Fabrication Unit> SAW Filter Process Flow> BAW Filter Process Flow> Packaging Process Flow> Final Assembly Unit
> Cost Analysis Overview> The Main Steps Used in the Economic Analysis> Yield Hypotheses> SAW and BAW Die Cost- SAW filter and BAW filter front-end (FE) cost- SAW filter and BAW filter FE per steps cost- Back-end: tests and dicing- SAW filter and BAW filter wafer and die cost> Component- Packaging cost- Packaging cost per process step- Component cost
Estimated Price Analysis
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BAW filter schematics
SAW and BAW filter manufacturing process flow
Metal seal packaging process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Filter technology comparison with Qorvo and Broadcom filters
Packaging technology comparison with Qorvo and Broadcom
Comparison with previous generation of Taiyo Yuden Band 7 Duplexer