Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

TDK-EPC P8009 Module with Maxim Embedded Dies

tdk emv2
2 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 36% on your package – Contact us!


Yole RP133 TDK P8009 PMU with Maxim Embedded Dies iconeFlyerOne of the few high volume 3D embedded dies package
Latest evolution of the TDK SESUB process.

TDK-EPC and Maxim Integrated have joined forces to provide an innovative power management solution with an embedded die technology.

Integrated in some version of the BlackBerry Z10, the P8009 Power Management Unit (PMU) of TDK-EPC is one of the few high-volume embedded dies package. It integrates two ICs from Maxim Integrated, a power management IC (PMIC) and a 16-bit MCU, to reduce the module size by 60% compared to using conventional discrete devices and BGA packages.

The embedded die process of TDK-EPC, called SESUB (Semiconductor embedded in SUBstrate), is an innovative packaging technology based on the emerging embedded die in laminate substrate concept where all of the package assembly operations are done at the panel-scale level. A 4-layer 3D interconnection routing path with 20µm minimum line width is provided. This technology extends the package size beyond the ICs surface area and allows for mounting additional passives components on top of the laminated module.

With this packaging approach, TDK considerably changed the conventional supply chain model, where the chip maker sells directly to the system maker. Here the module maker is taking a larger role by adding considerable value.

tdk emv

This report provides a complete teardown of the embedded dies package with:

  • Detailed photos & Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Exhaustive cost breakdown and selling price estimation

Table of contents

Companies Profile
P8009 Characteristics & Supply Chain
P8009 Physical Analysis
> Physical Analysis Methodology
> Module Views & Dimensions
> Passives Components & Functions
> Module Delamination
> MAX8955E – Die View, Dimensions & Marking
> MAX8955E – Die Process
> MAXQ6831 – Die View, Dimensions & Marking
> MAXQ6831 – Die Process
> Cross-Section 1 Overview
> Cross-Section 1 – Complete PCB
> Cross-Section 1 – Layer 1-2
> Cross-Section 1 – Layer 2-3
> Cross-Section 1 – Layer 3-4
> Cross-Section 2 Overview
> Cross-Section 2 – Shield Case
> Cross-Section 3 Overview
> Cross-Section 3 - MAX8955E
> Cross-Section 3 - MAXQ6831

Manufacturing Process Flow

> Global Overview
> MAX8955E Process
> MAXQ6831 Process
> ICs Wafer Fabrication Units
> SESUB Embedded Die Packaging Process Flow
> SESUB Panel Fabrication Unit
> Passives Assembly Process Flow

 Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> MAX8955E Front-End Cost
> MAX8955E Back-End 0 : RDL, Probe Test, Thinning & Dicing
> MAX8955E Die Cost
> MAXQ6831 Front-End Cost
> MAXQ6831 Back-End 0 : RDL, Probe Test, Thinning & Dicing
> MAXQ6831 Die Cost
> SESUB Panel Cost
> SESUB Panel Cost per process steps
> SESUB Panel : Equipment Cost per Family
> SESUB Panel : Material Cost per Family
> SESUB Panel : Panel Efficiency
> SESUB Packaging Cost per Module
> Passives Components Cost
> Passives Assembly Cost
> P8009 Module Cost & Price



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.