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2.5D, 3DIC and TSV Interconnect Patent Investigation
May.2013

yole 3dicpatent example of patent mapping may 2013 378486074
5 990 €

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Description

YOLE 3DICPatent 20133DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation.

A very young patent landscape dominated by 10 companies...

For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened. 52% of the families have been classified as relevant and further studied. The indepth analysis quickly revealed that the overall patent landscape was pretty young with 82% of patents filed since 2006. Actually about 260 players are involved in 3DIC technology while the top 10 assignees represents 48% of patents filed in the 3DIC domain! We selected 5 companies from these 10 most active players to focus on and lead an accurate analysis of their patent portfolios.


Yole 3DICPatent Top


The report also provides a database of all the relevant patents we have analyzed in an Excel file which allows multi-criteria searching. The criteria are basically those we used for the technological segmentation:

  • Patent information
    • Patent publication number
    • Link to the PDF document
    • Oldest priority date
    • Title
    • Assignee
    • Patent potential ranking
    • Nb of citing patent families
  • Technological segmentation
    • Design
    • Process: lithography, etching, metallization, passivation, filling, repassivation, UBM, bonding, thinning
    • Test
    • Architecture
  • End Application mentioned
    • Memory
    • Interposer
    • Logic Sip / SoC

Yole 3DICPatent Evolution of top 15 priority country May 2013
We found 4 main types of business models among the top 10 assignees involved in this mutating middleend area:

  • Foundries and IDM: IBM, Samsung, Intel
  • OSATs: STATS ChipPAC, Amkor
  • Memory IDM/Foundries: Micron, SK Hynix, Elpida
  • Research centers: ITRI

It is also interesting to notice that the USA is the early player increasingly involved in 3DIC since 1969. China and Korea are new players since 2005.

This complete description of the patent landscape is included in the first part of the report and provides all the background materials for the 3DIC patent landscape analysis. The report provides a complete analysis of the patent landscape including geographical origins of the patents, companies or R&D organizations that have been granted the patents, historical data on when the companies that have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations…

Understanding the patent portfolio of the top 10 3DIC asignees

The report provides a deep dive into each of the patent portfolios of assignees selected by Yole Développement, including Intel, Samsung, Micron, IBM and TSMC.

For each of these companies, the report provides an in-depth analysis of its patent portfolio, highlighting the following points:

  • Company patent portfolio evolution
  • Countries of deposition and origin of the patents
  • Top inventors
  • Technical segmentation of each patent portfolio
  • Patent portfolio analysis for each manufacturing process steps and architecture
  • Main technical innovations

This analysis of each company provides an in-depth view of the strengths and weaknesses of the patent portfolio of each company and the developments that are now implemented by these companies.

Yole 3DICPatent Example of patent mapping May 2013An overall patent ranking to identify the most promising patents!

A ranking of the most important patents is provided in this report to highlight the most promising. Other information includes: which of all the analyzed documents could be blocking, which company owns which patents and the contents of each patent. The ranking is based on a unique methodology which has been developed by KnowMade, Partner of Yole Développement, and is based on the evaluation of 14 parameters:

  • Description
  • Independent claims
  • Life expected
  • Applicant type
  • Innovation intensity of application field
  • Market size
  • Geographical application
  • Legal status
  • Geographical protection
  • Competitor type
  • Technology infringement capability
  • Innovation type
  • Application filed

These parameters enable patent potential to be evaluated through 4 dimensions. The final patent potential is the average of scores for each parameter. A score between 1 and 10 is thus calculated for each dimension and for the global patent potential.

Methodology of the analysis

Based on requests on micropatent, and several other databases, Yole Développement has developed a unique methodology (described in the sample) to define a technical segmentation of the patent landscape, define which patents are the most innovative, either for future use or already in production. Yole Développement, by mixing its technical knowledge, business understanding and patent search, is able to provide unique analysis and added value in this report.

Table of contents

Context and objectives 3

Companies cited in the report 11

Introduction to 3DIC technology 12

Methodology for patent screening, analysis and ranking 27

IP landscape overview 36

> Trends on patent filling
> Geographical mapping (countries of origin, countries of deposition)
> Top 15 priority countries
> Legal status of patent fillings
> TOP10 patent assignees for 3DIC technologies
> Evolution of the major assignees for 3DIC
> Recent assignees for 3DIC
> Top inventors
> Top academics and R&D centers
> Assignee collaboration
> Citation network
> Main collaborations

Global patent ranking and patent potential analysis 54


Key player patent portfolio analysis 59


> Focus on Intel Corporation
- Company profile
- Patent distribution and evolution
- Key patent family ranking, most cited patent identification
- Patent mapping
- Qualitative analysis of key patents
> Focus on Samsung
- Company profile
- Patent distribution and evolution
- Key patent family ranking, most cited patent identification
- Patent mapping
- Qualitative analysis of key patents
> Focus on Micron
- Company profile
- Patent distribution and evolution
- Key patent family ranking, most cited patent identification
- Patent mapping
- Qualitative analysis of key patents
> Focus on IBM
- Company profile
- Patent distribution and evolution
- Key patent family ranking, most cited patent identification
- Patent mapping
- Qualitative analysis of key patents
> Focus on TSMC
- Company profile
- Patent distribution and evolution
- Key patent family ranking, most cited patent identification
- Patent mapping
- Qualitative analysis of key patents

Conclusions and perspectives 187


Introduction & presentation of
Yole Développement’s activity 190



Companies Cited

3M
AdvanPack Solutions
AEM Tec
Ajinomoto
Akita
Altera
AMD
Amkor
Apple
Applied Materials
ASE
Asymtek
Bergquist
Carsem
Casio Micronics
Chipbond
Chipmos
Chomerics
Cookson
Dalsa
Datacon
Dek
Denka
Dow Chemical
Dow Corning
Elpida
EM Microelectronic
Epcos
eSilicon
FCI
Fraunhofer IZM

Fuji Polymer
Fujitsu
GLOBALFOUNDRIES
Global Unichip
Henkel
Hitachi Chemical
Honeywell
Ibiden
IBM
IC interconnect
IMI
Indium Corporation
Infineon
Intel
Ipdia
JCAP
J-devices
Kinsus
Kyocera
LB Semicon
Lord Corporation
Lumileds
Micrel
Minami
Murata
Namics
Nanium
Nan Ya
Nepes
Nexx
Nichia
Nokia
Nordson
Nvidia
NXP
OKI
Omnivision
Optopac
OSE
Pactech
Panasonic
Polymatech,
PowerTech (PTI)
Premier Semiconductor Services
Qualcomm
Renesas
Samsung
Samsung Electromechanics (SEMCO)
Shibuya
Shin Etsu
Shinko Electric
Silex Microsystems
Siltech
Sony Chemical
SPIL
STATS ChipPAC
SK-Hynix
STMicroelectronics
Sumitomo
TDK
Tessera
Texas Instruments 

 

KEY FEATURES OF THE REPORT

  • Statistical analysis of existing IP to give a landscape overview and understand: the evolution of patent families and who are the main players involved in this field
  • In-depth analysis on 5 player portfolios selected by Yole Développement: focus on IBM, Intel, Samsung, TSMC and Micron
  • Patent ranking and detailed analysis of the key patents
  • patent