Smaller package and improved accuracy in a pressure sensor for wearables!
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380 pressure sensor is more accurate than the previous BMP280 pressure sensor. Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressure sensor and a temperature sensor.
It is equipped with only one MEMS die and an amplification application-specific integrated circuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexible pressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. A thorough package analysis is included in this report, which also describes and compares MEMS and ASIC technology evolutions.
This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison with Bosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s two environmental sensors, the BME280 and the BME680.
Overview / Introduction
Company Profile and Supply Chain
> Bosch Sensortec> BMP380
> Synthesis of the Physical Analysis> Package- View and dimensions- Opening- Wire bonding process- Cross-section> ASIC Die- View and dimensions, delayering and main blocs, process, cross-section, process characteristics> MEMS Pressure Die- MEMS die view and dimensions, cross-section- MEMS pressure and temperature process- MEMS pressure and temperature characteristics
> Physical Comparison- Bosch environmental sensor evolution- Comparison with STMicroelectronics’ LPS22HB
Sensor Manufacturing Process
> ASIC Die -Front-End Process and Fabrication Unit> MEMS Process and Fabrication Unit > Final Test and Packaging Fabrication Unit
> Synthesis of the Cost Analysis
> Yields Explanation and Hypotheses
> ASIC Component- Die front-end cost / probe test, thinning and dicing- ASIC component cost
> MEMS Pressure Die- Die front-end cost / probe test, thinning and dicing- Sensor die cost
> LGA Packaged Component- LGA packaging cost- Back end: final test- Component cost
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Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Comparison between BMP280, BME280, BME680, and BMP380