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Thin-Film IPDs
Nov.2012

thin film ipd 2011 revenue
5 990 €

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Description

Yole ThinFilmIPDs 2012Thin-film integrated passive & active devices are rapidly growing within ESD/EMI protection, LED, RF, digital & mixed signal applications

A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications.

This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.


Thin film IPD Market Forecast

ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space.  NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA’s leadership in the integration of IPDs?  If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components into its end-products, while Samsung recently has been quite conservative in adopting this technology.

With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of ~17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE, etc…) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution.  Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates.  Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.

Still, important commercialization opportunities exist for ‘custom designed’ IPDs in  niche and specialty markets, such as medical pace-makers, camera-pills, smart-meters and high reliability applications such as automotive, power electronic, aerospace and defense applications.

TOP 3  PLAYERS HOLD ALMOST 60% OF THE MARKET: NXP, STMicroelectronics & ON SEMICONDUCTOR

Europe is still by far the largest geographical area for the production of thin-film IPDs with the support of STMicroelectronics (FR), NXP  (NL), IPDiA (FR) and Infineon (DE).

Following is North America with an important number of power, analog and mixed signal semiconductor companies
such as Texas Instruments (US), Semtech (US), MicroSemi (US), Littlefuse (US), Protek (US) and ON Semiconductor (US), which acquired two IPD companies recently: CMD (US) in 2009 for $108M and SDT (US) in 2010. On Semiconductor is now the third largest IPD company worldwide and is in the position to challenge well established European players STMicroelectronics (FR) and NXP (NL).

Thin Film IPD 2011 revenue

Japan may keep lagging because of the presence of the largest discrete IPD makers locally (Murata, Panasonic, Epcos-TDK, Kyocera, Taiyo-Yuden…) which are not yet aggressively pushing this technology in the market.

More and more packaging, assembly and test companies (also called ‘OSATs’), STATS ChipPAC (SG), Amkor (KR) and SPIL (TW) have entered the IPD market through very different business models. Taiwan related activity is set to increase significantly in the next few years with the entrance of ASE (TW) and TSMC (TW) into this business

MANY KEY TECHNOLOGIES IN THE  STARTING BLOCKS OF THIS INDUTRY’S ROADMAP

In terms of component structures and materials, different evolutions are expected in the thin-film IPD technology roadmap. New inductor technologies will enable ever higher integration densities and Q-factor. New capacitor technologies such as 3D trenches will break out the 500nF/mm2 density challenges and enable new applications un-targetable before. New material depositions and techniques will be applied to get along with ferroelectric IPDs and  meet with new ROHS regulations.  New approaches, such as Paratek (US) acquired by RIM (CA), will be developed to build antenna tuner components for multi-band and multi-mode wireless products.

The importance of packaging has a strong impact on IPD technology.  Several different evolutions are expected beyond the used of standard assembly techniques, including the emergence of TSV ‘Through-Silicon-Vias’ and TGV ‘Through-Glass-Vias’ interconnects, as well as Embedded chip in PCB  and FOWLP  type of packages

In terms of manufacturing infrastructure, a slow transition is happening: if the initial commercialization of IPD technology was supported by 150mm wafer fabs, 200mm is today the main infrastructure supporting recent IPD technology commercialization.  Many 8’’ factories are now in operations, such as STMicroelectronics (FR) in Tours, NXP (NL) in Hamburg Germany, ON Semiconductor (US) in Arizona, STATS ChiPAC (SG) in Woodland, and in Taiwan ASE  and TSMC. It is becoming clear that at some point, a larger infrastructure on 300mm will be needed to support the commercialization of this technology, as cost pressure and volume adoption increases and IPDs are penetrating further the wireless consumer market.


Thin Film IPD Technology Industrial

This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.

Each market sub-segment is exhaustively detailed with:

  • Drivers and benefits of IPDs
  • Sub-segment size and expected growth rate
  • Value chain analysis
  • Global market evaluation per application: volume in units, wafers, and market size ($).
  • Evaluation of the major market players (market share)
  • Key thin-film IPD product detailed teardown analysis

Table of contents

Objectives of the Study 5
Introduction, Definitions & Scope of the Report 11
> Overview of discrete versus integrated passive solutions
> Integrated active and passive structure definitions (inductor, capacitor, resistors, diodes, combinations…)
> Comparison between thin-film / thick film IPD technologies (including ceramic LTCC)
> Executive summary

Thin-Film IPD Applications and Market Drivers 40
> ESD/EMI protection
> LED Lighting protections
> RF IPD
> Digital & Mixed Signal IPD
> For each category, you will find the analysis of
- IPD current and future applications
- IPD benefits and market driver descriptions for each IPD function and application
- IPD functionalities by category

Thin-Film IPD Market Status & 2011-2017 Forecasts 142
> IPD market forecasts are provided both in $M, Munits and in wafer eq. with attached CAGR p 143
- Volume shipments for IPD by application (cell-phone, mp3 players, medical, automotive…)
- IPD shipments by category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)
- Specific applicative breakdown and forecast evolution for each category
- IPD shipments by substrate type (Silicon, Glass,…) and wafer size (6” / 8” / 12”)
- IPD shipments by integration choice (discrete, Above IC, SiP package…)
- IPD shipments by packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…)
Thin-Film IPD Supply Chain & Players 175
> Geographical mapping of different players 
> IPD player market shares and revenues 
- “Top 10” IPD players’ 2008 revenues
- Market share breakdown for ESD/EMI protection and RF IPD applications
> Business model analysis for IPD
> Summary of IPD player capabilities

Thin -Film IPD Technologies 198
> Overall IPD Technology roadmap
> IPD technology requirements & options
- Performance and integration capabilities
- Inductors (multilayer planar inductors, 3D inductors…)
- Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)
> IPD Manufacturing challenges and related equipment & material tool-box
- Substrate choice technology comparisons
- Dielectric layer options (low k / high k)
- Trend for ferroelectric IPDs
- Available photoresists, oxide and other layer solutions, impact of layer thickness
- Metallic layer formation (Al, Copper, Gold…)
- Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)
> IPD Design, Simulation and predictability through system level co-design 

Thin-Film IPD Architecture, Assembly & Packaging 249
> Integration, packaging and assembly platforms options for IPDs
> Through-Silicon-Via manufacturing: a necessary step to reach the 3rd dimension
> Fan-Out Wafer level packaging and embedded die technologies

Conclusions & Perspectives 289

 

Companies Cited

Aiconn
AMD
Amkor
Analog Devices
Apple
apm
ASE
Avago
AVX
AzureWave
Broadcom
Bourns
Bridgelux
CMD
Cree
CSR / Samsung
Energy Micro
Epcos – TDK
Kyocera
Fairchild Semi
Flip-Chip International
Fraunhofer-IZM institute
Freescale
Fujikura
Fujitsu
Gemtek
Icera / nVidia
Ibiden
IBM
IMEC
Infineon
IPDiA
Ibiden
IME
IMEC
Intel
ITRI
Qualcomm - Atheros
Leti
Littlefuse
LG Innotek
Lumileds
Maxim IC
Microsemi
Murata / SyChip
Nichia
NEPES
Nokia
Nordic Semiconductor
NXP
OnChip Devices
ON Semiconductor
Panasonic
Panjit Semiconductor
Paratek
ProTek Devices
Renesas
RFMD
RIM
Samsung
Sequans Communications
Shinko
Silex Microsystems
SiGe Semiconductor
Skyworks
Semtech
StatsChipPAC
ST Ericsson
STMicroelectronics
Sony
SPIL
Transfer Jet
Telephus / SEMCO
Taiyo Yuden
Texas Instruments
Touch Microsystems Technology
TSMC
Toshiba
Triquint
Tyndall
USI
Viking Tech
Vishay
Wavenics
Wi2wi
Wispry
Zarlink

 

KEY FEATURES OF THE REPORT

  • 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD)
  • Market trends and figures provided both in $M, Munits and wafer size equivalent
  • Technology roadmap and complete technologies and material tool-box analysis
  • 30 detailed company profiles of key  thin-film IPD players (320+ slides PPT)