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Thin Wafers, Temporary Bonding Equipment & Materials Market
Oct.2012

thin wafer shipment 2011-2017 forecast in 300mm eq - copie
5 990 €

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Description

YOLE ThinWafers 2012Memory, Logic, Power Devices & Image Sensors markets will drive the thin wafers market and related handling technologies

WITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY 2017, TEMPORARY BONDING MARKET  WILL INCREASE IN THE COMING YEARS

This Yole Développement report describes why thinner wafers will be needed in the future, especially for consumer applications. Indeed, consumer electronics is a big driver for smaller, higher-performing, lower-cost device configurations for use in various applications, such as memory and wireless devices. These new configurations, in turn, are pushing demand for thin (< 100 µm) and even ultra-thin semiconductor wafers (below 40µm) with the following benefits:

  • Reduced thickness and thus thinner packages (in cell phones, packaged dies must be < 1.2mm thick; this number shrinks to1mm for smart phones)
  • Wafer thinning is the most efficient approach used for heat dissipation in thermal management
  • For 3D integration, thin wafers bring higher through Si vias density, as pitch and dimensions are becoming smaller


Thin wafer shipment 2011-2017 forecast in 300mm eq - Copie
However, as wafer thickness decreases to 100µm and below, manufacturing challenges arise. Ultra-thin wafers are less stable and more vulnerable to stress, and the die can be prone to breaking and warping—not only during grinding but also during subsequent processing steps. Yole Développement’s report describes why special thin wafer handling processes (i.e. temporary bonding) are necessary, especially when wafers are dual-side processed or have high topographies.
This report deals not only with the thin wafers market and applications, but also with related processes, equipment, and materials for temporary bonding.

Thin wafer shipment forecasts are analyzed, as there is definitely a growing need for thin wafers (below 100 µm) for numerous applications: 3D ICs, MEMS, CMOS Image Sensors, Power Devices, LEDs, RF Devices, Memory & Logic, Interposers and Photovoltaic. The report shows that, by 2017, the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) will be 74%, corresponding to > 80M 12’’ eq. wafers.
Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs, and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mm wafer bonding tools, thanks to BSI. This application requires ultra thin layers (< 10µ) on 12’’.

Forecasts by wafer thickness are analyzed in the report. In 2017, most of the 12’’ wafers will be 200µm thick for logic application; also, most of the thinned wafers will be in the 10-99µ thickness range. This includes memory, as well as  interposers and power device applications.

CURRENTLY LOW IN VALUE, THE TEMPORARY BONDING EQUIPMENT MARKET WILL REACH US$250M BY 2017

Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding.

Yole Développement’s report provides a temporary wafer bonding equipment forecast which shows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017. So, while temporary bonding equipment is still a small market today, it is expected to grow as the need for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools to be more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICs applications. However, we believe 3D ICs will become the predominant application for temporary bonders > 2015.

Thin wafer handling solutions - Copie
Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.

Table of contents

Why this report 4


What is new compared to 2011 report 6


List of companies mentioned in the report 7


Executive summary 8


THIN WAFERS 22


2011-2017 thin wafer market forecasts 24


> Thinned wafers vs. TOT number of shipped wafers
> Thin wafers shipment in 300 mm eq. 
> 2011-2017 thin wafer shipment forecast by application in units 
> In US$ 
> 2011-2017 thin wafer shipment forecast by wafer diameter in units 
> In US$ 
> 2011-2017 thin wafer shipment forecast by wafer thickness in units 
> In US$ 
> 2011 Thickness Breakdown
> 2017 Thickness Breakdown

Description of applications 39


> TOP Thin wafers processors
> Thin wafers processors production ranking
> Thin wafers processors by application
> Thin wafer processing geographical breakdown
> Grinding players
> MEMS
> CMOS Image Sensors
> Memory & Logic
> Power Devices
> RF Devices (GaAs)
> LEDs
> Advanced Packaging
> Photovoltaic

THIN WAFERS HANDLING 141


Temporary bonders / Carriers / Materials forecast 142


> Temporary bonded wafers forecast
> Temporary bonders forecast in $M/units
> Temporary bonders forecast by wafer size
> Temporary bonding materials forecast
> Est 2011 temporary bonding players market share

Thin wafer handling: the different solutions 154


> Wafer handling with carrier:  temporary bonding
> The different temporary bonding techniques
- Thermal plastic release
- Mechanical release
- ZoneBOND
- YAG laser release
- Excimer laser release
- Chemical release
> Temporary bonding materials
> Wafer handling with carrier: electrostatic carrier
- The “Magic” material
- Carriers
> Wafer handling without carrier
> Wafer handling with ring technology
> Wafer thinning
> Wafer dicing

Final conclusions 264


Companies Cited

1366 Technologies
3M
AAC
ABB
Accretech
ADI
AGC
ALSI
Altera
AMAT
AMD
Amkor
Ampulse
ANJI
Aptina / Micron
ASE
AstroWatt
Avago
Brewer Science
Cabot
Canon
Corning
Cree
Crystal Solar
Dalsa
Danfoss
Discera
Disco
Dongjin
DoubleCheck Semiconductors
Dupont
Dynatex
Ebara
EM Marin
Epistar
Epoxy Technologies
ERS
ESI
EVG


Fairchild
Fraunhofer IZM
Freescale
GCL Solar
Hamamatsu
Hitachi Chemical
Hynix
IBM
Imec
Infineon
Intel
International Rectifier
Invensense
Ipdia
LDK
Leti
LG Innotek
Lintec
Lumileds
MEMC
Micron
Misui Chemical
Mitsubishi Electric
Nichia
Nitronex
Nitta Corp.
Nitto Denko
Okamoto
Omnivision
ON Semi
Osram
Panasonic
PlanOptik
Protec
Qualcomm
REC
Renesas
ReneSola
RFMD


Robert Bosch
Roockwood
S’Tile
Samsung
SanRex
Schott
Sensonor
Seoul Semiconductor
Shinko
Sigen
Silex
Skyworks
Solarforce
SPIL
STMicroelectronics
Strasbaugh
STATSChipPAC
Sumitomo Chemical
SUSS MicroTEC
Synova
Taiko
Tekcore
TEL
TMAT
TOK
Toyoda Gosei
Triquint
Twincreeks
VisEra
WLCSP
Xilinx
Xintec
Yushin.

 

KEY FEATURES OF THE REPORT

All applications of GaAs wafer and market metrics, detailing:

  • Provide an understanding of the thin wafers application
  • Present market forecasts for thin wafers
  • Analyze wafer thinning trends, with a focus on temporary bonding
  • Market Forecasts for temporary bonding in US$ value and number of equipment
  • Market Forecast for temporary bonding chemistry