Yole Group of Companies had the opportunity to participate to
ELECTRONICA / SEMICON EUROPA in Munich, Germany from November 13 to 16, 2019. The analysts attended the show to meet the experts of the electronic industry, share their vision of the latest technical innovations and understand the market evolution.
With 18 halls, numerous conferences and qualified audience including 73,451 trade visitors and 2,912 exhibitors, the show was the place to be in Europe. The whole microelectronic supply chain attended the show: from materials suppliers to devices markers, including equipment manufacturers, design houses, foundries and more, all players were there to meet their customers and partners. Number of business meetings taking place in Munich last week is probably remarkable and also confidential.
In addition of two booths, one in the SEMICON EUROPA hall and one at ELECTRONICA, Yole Group proposed a relevant program of presentations. Semiconductor manufacturing, RF electronics, batteries, power electronics & compound semiconductors, MEMS & sensors… the analysts covered a wide landscape to highlight the latest technical and market trends and point out the competititve landscape.
Who is doing what? What are the latest innovations? What is the status of this market? … Here are the several presentations held during the show :
- Amandine Pizzagalli, Technology & Market Analyst, Equipment & Materials held a presentation on ‘Wafer for More than Moore applications is becoming a major market“
- Claire Troadec, Division Director, Power & Wireless held a presentation on ‘5G: Who has the most to win (and lose)?’
- Milan Rosina, Principal Technology & Market Analyst, Power Electronics & Batteries held a presentation on ‘How battery pack evolutions create opportunities for power electronics companies’ and ‘GaN and SiC power device: market overview’
- Eric Mounier, Principal Analyst, Technology & Market, MEMS & Photonics held a presentation on ‘Status, Challenges and Opportunities for MEMS and Sensors’
Related Reports and Monitors
Power SiC 2019: Materials, Devices, and Applications
Market & Technology
Qualcomm 3D Sonic Sensor Fingerprint
Reverse Costing - Structural, Process & Cost Report