Si IGBT is leading the power electronic industry

“Silicon devices such as IGBTs are benefiting from mature infrastructure and processes. New device generations are coming to the market. In addition to performance improvements, Si IGBT costs will further be reduced thanks to a 12-inch Si wafer transition that will make the competition with WBG materials even tougher.” asserts Amine Allouche, Technology & Cost Analyst at System Plus Consulting.

According to System Plus Consulting’s partner, Yole Développement (Yole), in its Status of the Power Electronics Industry 2020 report, Si devices represent the majority of the power electronics  devices market. Looking back in 2019, the whole power semiconductor device market segment was worth US$17.5 billion, with a CAGR for 2019-2025 of 4.3%. IGBT modules, which represented US$3.7 billion in 2019, are traditionally used in applications such as industrial or renewable energy converters. These applications are today driven by efficiency regulations or increasing clean energy goals, and they account for 46% of the total IGBT module market. Nevertheless, the key application for power IGBT modules is undoubtedly EV/HEV, with an expected growth of 18% from 2019 to 2025.

In this dynamic context, Yole and System Plus Consulting, both part of Yole Group of Companies, investigate disruptive power electronics technologies and related markets in depth. Both companies point out the latest innovations and underline the business opportunities.

  • In its Silicon IGBT Comparison 2021 report, System Plus Consulting presents the state of the art of 31 Si IGBT transistors of eight voltage classes from 11 leading IGBT players. The report highlights the main differences and common points in device design and manufacturing processes. System Plus Consulting’s analysts point out IGBT technologies and their impact on device size and production cost.
  • In parallel, System Plus Consulting analyses in details a selection of key power electronics components all year long. The Infineon EasyPACK™ FS100R12W2T7 is part of this selection. Supported by a full teardown of the module, the Infineon EasyPACK™ FS100R12W2T7 report reveals the technological choices made by the leading power electronics company, in its new IGBT7 chip.

What is the status of the IGBT technologies and their applications? What are the main market segments? What are the technological choices made by the industry leaders? System Plus Consulting presents today its latest reverse costing and engineering analyses of the IGBT technologies… Full story

Source: http://www.yole.fr/

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