Sundiode develops stacked RGB micro-LED pixel devices on a single wafer

Sundiode Inc of Campbell, CA, USA, a Silicon Valley-based company developing micro-LED technologies for display applications including augmented reality (AR) and mixed reality (MR), says that it has achieved fully stacked three-color (RGB) micro-LED pixel devices on a single wafer.

In the stacked-RGB pixel technology patented by Sundiode and developed in collaboration with KOPTI (Korea Photonics Technology Institute), a single pixel features three independently controlled micro-LED subpixels that are stacked vertically to allow full-color emission from essentially the entire area of the pixel. This pixel technology results in a very compact pixel structure and a substantial reduction in the pixel-transfer processing requirement for micro-LED display fabrication, says Sundiode. In addition, the operation of a full-color micro-display consisting of a pixel-array typically sized smaller than a penny is significantly enhanced due to increased utilization of the extremely small pixel area, adds the firm.

Graphic: A diced array of stacked-RGB pixels (left most). R, G and B subpixels of three adjacent pixels of an array with each subpixel lit up separately (round-robin colors, middle three), and the subpixels of the center pixel lit up simultaneously to 5400K white (right most).

The stacked-RGB pixel technology is said to overcome a particularly difficult obstacle to the mass commercialization of micro-LED displays, i.e. a need for laborious pixel-transfer processing. Whereas fabricating a micro-LED display using conventional planar-RGB technologies typically requires transferring discrete R, G and B subpixels using a pick-and-place process, the stacked-RGB pixel technology substantially or even entirely removes such a requirement… Full article

Source: http://www.semiconductor-today.com

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