SUSS MicroTec and Georgia Institute of Technology establish partnership for Bio-medical devices and semiconductor 3D packaging research

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Georgia Institute of Technology (Georgia Tech) announced today a collaboration for nanotechnology, bio-medical and semiconductor 3D packaging research.

As a part of a broadening alliance, a SUSS MicroTec Mask Aligner will be added to a cluster of SUSS MicroTec equipment currently installed in the Institute for Electronics and Nanotechnology (IEN) cleanrooms at Georgia Tech, dedicated for bio-medical device research and fabrication. In early 2015, SUSS MicroTec also joined Georgia Tech’s Packaging Research Center (PRC) where advanced exposure tools, including excimer laser ablation systems, are utilized for via drilling on non-photosensitive materials. Initial results of the collaboration on via drilling were jointly presented by SUSS MicroTec and PRC at IEEE Electronic Components and Technology Conference (ECTC) in San Diego on May 26~29, 2015.

Georgia Tech’s IEN maintains a leading research facility and is part of the NSF-funded National Nanotechnology Infrastructure Network (NINN) formed by 14 US universities”, states Dr. Oliver Brand, Executive Director of IEN. “The addition of this new technology will provide needed functionality for our bio-medical and micro-fluidic research by enhancing our soft lithography capabilities with a wide number of related nanotechnology applications. IEN is dedicated to providing access to this state-of-the-art facility and technology workshops to outside industrial users. It is also Georgia Tech’s vision to train a local workforce for the growing demand in the nanotechnology industry, particularly in the US Southeast region”.

Excimer laser ablation provides a simple solution for imaging on non-photo-sensitive materials without the high cost of conventional photolithography where multiple coating, exposure, developing and etching processes are required”, says Professor Rao Tummala, Director of Packaging Research Center at Georgia Tech. “We are fortunate to have access to advanced exposure tools like excimer laser ablation systems to demonstrate smaller features such as via drilling down to 1µm”.

The close cooperation with universities and research institutions is of great importance for SUSS MicroTec. We benefit from their fundamental knowledge and expertise and gain significant insights that are vital for our future development work.” says Ralph Zoberbier, General Manager Exposure and Laser Processing at SUSS MicroTec. “We are excited to deepen our relationship with the Georgia Institute of Technology, which is a leading industrial research partner for the high potential growth markets of bio-medical and emerging advanced packaging applications, like 3D-IC, 2.5D interposer solutions and panel size packaging”.

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit


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