System-in-Package industry: IDMs, OSATs, and foundries are taking the advantage

Through enabling design and supply chain agility, SiP will reach more than $19B by 2026.

“SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the Semiconductor, Memory & Computing division at Yole Développement (Yole). He adds:“The SiP platform is crucial in achieving ‘More than Moore’ in the race for heterogeneous integration, where advanced packaging remains at the forefront with front-end technology.”

The SiP market is expected to increase from US$14 billion in 2020 to US$19 billion+ in 2026. The SiP product line includes high- to mid-end SiP devices, such as computing and data center applications, with much higher margins than the low-end SiP devices found in mobile handsets. High-end SiP market segment is expected to grow at a 9% CAGR between 2020 and 2026, whereas the low-end RF SiP one, found in mobile phones, is expected to grow at a slightly lower CAGR of 5% from 2020 to 2026.

In this dynamic context, Yole and System Plus Consulting, both part of Yole Group of Companies, investigate disruptive semiconductor technologies and related markets in depth. They point out the latest innovations in the packaging industry and underline the business opportunities.
Released today, the System-in-Package Technology and Market Trends 2021 report from Yole describes technologies that can be classified as “System-in-Package”, identifies and details the SiP platform’s key process steps. Including market trends and forecasts, supply chain, technology trends, technical insights and analysis, take away and outlook, this study also delivers an in-depth understanding of the ecosystem and main players’ strategies.
In addition, the Smartphone Design Win Quarterly Monitor from the reverse engineering and costing company, System Plus Consulting, utilizes data from representative phones (65+ phones per year torn down in the System Plus Consulting Phone Teardown Track Module) and follows the OEM market share. The monitor provides the detailed design wins and related supply chain for the eight phones being analyzed, along with supply chain alternatives for the main devices. It also delivers added value analysis of the packaging technologies selected by the leading smartphone manufacturers and their suppliers.

Yole and System Plus Consulting present today their vision of the SiP technologies and related markets.

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Source: http://www.yole.fr/, https://www.systemplus.fr/

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