The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on IC packaging to extend the benefits of the More-than-Moore era. Thus, advanced packaging has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and megatrends in transportation, 5G, consumer, memory & computing, IoT (and IIoT), AI, and HPC.
The market research & strategy consulting company, Yole Développement (Yole) releases today its annual technology & market analysis, Status of the Advanced Packaging Industry. This report explores the field of advanced packaging and represents a comprehensive yearly overview of the latest market and technology developments. Yole’s analysts propose a review of the drivers for advanced packaging and the latest market dynamics. They also examine packaging technology evolution with the help of short- and long-term roadmaps. This new edition also includes is an analysis of the trends and challenges related to advanced packaging technology, supported by detailed roadmaps for the various packaging platforms.
What is the status of the advanced packaging industry? What happened in 2018 and what to expect in 2019 and 2020? What will be the impact of the US-China trade war on semiconductor business & related supply chain? What is the strategy of the leading advanced packaging companies?… Yole’s analysts draw up a review of this industry and detail their expectations… Full article.
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