The CMOS image sensor market stands firm during the pandemic – Live Market Briefing Video

At the end of 2019, the CMOS image sensor (CIS) market experienced price rises of nearly 10% because of production reaching maximum worldwide capacity levels.

Even though the COVID-19 lockdown led to a drop in smartphone shipments, the demand for mobile camera modules will maintain a 7% year-over-year (YoY) growth in 2020. In the COVID-19 situation, no evident substantial impact on the CIS supply chain has been identified, including on the purchase of raw materials by giant players. The overall impact will be slower growth this year, with respect to the 25% YoY growth experienced last year.

Demand for CIS in the mobile space will keep growing. The overall attachment rate for CIS cameras per phone will move beyond 3.4 in 2020. Also, the growth rate for CIS attachment is still expected to be over 10% in the automotive space. The short-term impact of COVID-19 has led to a substantial decrease of car production. The end point for 2020 is very uncertain, and the long-term horizon is at best flat in volume. Looking at all markets the demand is still growing for CIS. The expansion of investment in CIS and capacity transition from DRAM to CIS will continue for most of the key players.

This briefing will give a snapshot of the current status of the CIS industry as of Q2 2020. It will cover near and long-term revenue, market share and the market demand environment, in order to proactively benefit from the next wave of innovations.


Pierre Cambou, Yole Développement

Pierre Cambou MSc, MBA, is a Principal analyst in the Photonic and Display Division at Yole Développement (Yole).
Pierre’s mission is dedicated to imaging related activities by providing market & technology analyses along with strategy consulting services to semiconductor companies. He is responsible for the CIS Quarterly Market Monitor while he has authored more than 15 Yole Market & Technology reports.
He has been deeply involved in the design of early mobile camera modules and the introduction of 3D semiconductor approaches to CMOS Image Sensors (CIS).
Known as an expert in the imaging industry, he is regularly interviewed and quoted by leading international media.
Pierre has an Engineering degree from Université de Technologie de Compiègne (France) and a Master of Science from Virginia Tech. (VA, USA), Pierre also graduated with an MBA from Grenoble Ecole de Management (France).

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