Substrate makers are developing new technologies in order to step up their performance in advanced substrate platforms.
Watch the replay of our webcast broadcast on July 2, 2019 now:
Historically, the IC substrate & board industry has assumed a passive role, especially with regard to innovation. However, in the past few years increasing competitiveness has encouraged substrate makers to pursue differentiation.
The advanced substrate market now follows advanced packaging trends: miniaturization, higher integration, and better performance are becoming the new mainstream. Today, substrate makers are at the forefront of developing innovative solutions such as substrate-like PCB (SLP), embedded die (ED), and flip-chip (FC) advanced IC substrates.
Leveraging the latest industry news and our own market, technology, device teardown, and supply chain analyses, this webcast will provide Yole’s insights regarding FC-BGA,FC-CSPSLP, ED, substrates.
AT&S presentation: “ Substrate Like PCBs for Module- and Systems-Integration”, will briefly address the status of mSAP and SAP technologies, and their potential to play a key role in heterogeneous integration at module and system level applications. Opportunities for component embedding vs. surface-mount & overmold technologies will also be briefly reviewed for key applications.
Join Yole Développement, System Plus Consulting and AT&S for an engaging webcast that covers the past, present, and future of advanced substrates, from technology to market.
Mario Ibrahim, Technology & Market Analyst | Advanced Packaging – Yole Développement
Stéphane Elisabeth, PhD, Expert Cost Analyst – System Plus Consulting
Dr. Martin Schrems, Director Strategy & Business Development – AT&S
David Jourdan, Sales Coordinator & Customer Service at Yole Développement
Status of Advanced Substrates 2019
Demands from the new digital age are waking up the sleeping substrate giants.
- Status of the Advanced Packaging Industry 2018
- 2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019
- Fan-Out Packaging: Technologies and Market Trends 2019
- TDK SESUB Bluetooth Module
Related Reports and Monitors
Sensirion SCD30: NDIR CO2 and Humidity Sensor
Aptiv’s Lane Assist Front Camera for Audi A8
Reverse Costing - Structural, Process & Cost Report