#Memory

May 23, 2019

Xperi announces DBI® Ultra die-to-Wafer hybrid bonding technology for high performance computing

Xperi (XPER) is proud to announce Invensas DBI Ultra, a revolutionary, patented die-to-wafer hybrid bonding, 3D interconnect…

LETI Innovation Days – 2019

Tradeshows & Conferences

Grenoble, France

#Display

#Equipment & Materials

#Imaging

#Memory

#MEMS, Sensors, Actuators

#Microfluidics

#Package

#PCB, Wafer, Substrate

#Photonics & Optoelectronics

#RF Devices

#Software & Computing

#Solid State Lighting