TSMC considering first chip packaging plant in US

Cheng Ting-Fang and Lauly Li for Nikkei Asia – Facility to handle increasingly important step in semiconductor manufacturing – Taiwan Semiconductor Manufacturing Co. is considering building another advanced plant in the U.S., Nikkei Asia has learned, as the world’s biggest contract semiconductor supplier responds to Washington’s desire to bring more of the tech supply chain onto home turf.

The new plant would carry out chip packaging, using advanced technology to integrate different types of semiconductors onto wafers. Innovation in packaging chips is emerging as an industry battleground for TSMC and rivals including Intel and Samsung, and this would be TSMC’s first such facility outside Taiwan.

TSMC is already building its first U.S. chip manufacturing plant in more than two decades — a $12 billion facility in Arizona, to go into production by 2024. It will make 5 nanometer chips — currently the most advanced generation of semiconductors that are used in Apple’s latest iPhone and Mac processors… Full article

Source: https://asia.nikkei.com

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