TSMC dominates the Fan-Out market: ASE and others are catching up

TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions.

“As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology and Market Analyst specializing in Packaging and Assembly at Yole Développement (Yole). He adds: “OSATs are also following this trend, offering innovative FO Packaging solutions that help solve front-end challenges with the slowing of Moore’s Law, resulting in bigger dies to improve performance.”

In this dynamic context, Yole and System Plus Consulting, both part of Yole Group of Companies, investigate disruptive semiconductor technologies and related markets in depth. They point out the latest innovations in the packaging industry and underline the business opportunities.
Released today, the Fan-Out WLP and PLP Applications and Technologies 2021 report helps industry players to understand the evolution of the FO Packaging market and technology, its roadmap, its significance, and its solutions for the next high-performance applications. It describes what capabilities each FO platform is offering. Including market trends and forecasts, supply chain, technology trends, technical insights and analysis, take away and outlook, this study also delivers an in-depth understanding of the ecosystem and main players’ strategies.
In addition, the HiSilicon Hi1382 Coherent Processor with ASE’s FOCoS report from the reverse costing engineering company System Plus Consulting, includes a full investigation of the component, featuring a detailed study of the FO-SiP solutions, including die analyses, processes, and package cross sections focused on the interfaces. It contains a complete cost analysis and a selling price estimation of the component.

What are the economic and technological challenges of the computing for datacenter industry? What are the key drivers? Who are the suppliers to watch, and what innovative technologies are they working on? What are the different existing technologies?

Yole and System Plus Consulting present today their vision of the FO WLP and PLP applications and technologies industry.

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Source: http://www.yole.fr/, https://www.systemplus.fr/

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