VIEWPOINT 2019: Hong Lin from Yole Développement

An article written by Hong Lin, PhD. from Yole Développement for Semiconductor Packaging News – Silicon carbide (SiC), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Indium Phosphide (InP)… The compound semiconductor industry enjoys a bright outlook, with double digit growth potential in different market segments.

If I need to highlight one compound for the year 2018, it would be SiC. The rumors of Tesla using SiC in its inverter was verified by reverse engineering analysis – see the report Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics by System Plus Consulting, partner of Yole Développement. The impact of this event is much more profound than we could have imagined. In Q3 & Q4, the inflow of information on SiC continued increasing, directly from both OEMs and Tiers 1.

The automotive sector will no doubt be THE driving market and it is expected to absorb the global capacity – see the report Power SiC 2018: Materials, Devices and Applications by Yole Développement. Yole’s question for 2019 is whether the SiC supply chain (from materials to modules) is ready?… Full article

Legend: Hong Lin, PhD., Senior Technology and Market Analyst, Compound Semiconductors, Yole Développement

Source: www.semiconductorpackagingnews.com 

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