WLCSP / Fan-In has been selected by Apple for its latest iPhones

The packaging platform secures its place in the mobile world.

“WLCSP / Fan-In packages are here to stay as they offer “best in class” solution for mobile applications,”asserts Vaibhav Trivedi, Senior Technology & Market analyst, Advanced Packaging at Yole Développement (Yole). WLCSP / Fan-In solutions are increasing scalability and offering best cost with reliable performance.”

Generally speaking, the global WLP market was worth US$3.3 Billion in 2019 and is expected to grow at an 8.9% CAGR to reach US$5.5 Billion by 2025. WLCSP / Fan-In was worth more than US$2 Billion in 2019 and is expected to grow at a CAGR of 3.2% to exceed US$2.5 Billion by 2025…
Yole, the market research and strategy consulting company, and its partner, System Plus Consulting, research the advanced packaging industry all year long. Thanks to daily exchanges with leading advanced packaging companies, analysts develop an extensive expertise in the technology evolution and market trends. This knowledge is delivered through an impressive collection of technical and market reports and monitors. The WLCSP / Fan-In Packaging Technologies and Market 2020 report is part of this compilation…

In advanced packaging technologies, WLP is becoming more and more popular due to its promise of the smallest and thinnest form factor with reasonable reliability. Wafer level Fan-Out, or Fan-Out and WLCSP, and Fan-In remain two powerful wafer level package families. Unlike Fan-Out, Fan-In offers the simplest process flow while providing thin, small form factors, easy to assemble, which populate many SiP and smartphone board assemblies… Full story

Source: http://www.yole.fr

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