Yole Group of Companies’ Presentations
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Find below the latest presentations of Yole Group of Companies’ experts
#PACKAGE
- Automotive sensing technologies and packaging – Semicon West – Mario Ibrahim – July 8, 2019
- Stacking is becoming necessary in multiple markets & applications – Leti Days 2019 – Mario Ibrahim – June 2019
- System-in-Package and heterogenous integration evolution of revolution – MiNaPAD – Stephane Elisabeth, PhD – May 23, 2019
- Packaging for Automotive industry – MiNaPAD – Mario Ibrahim – May 22, 2019
- Fan-Out Packaging – Semicon Southeast Asia – Favier Shoo – May 8th, 2019
- Advanced Packaging Market Trends – Semicon Southeast Asia – Favier Shoo – May 8, 2019
- Trends in Automotive SiP Systems – Advanced Packaging & System Integration Symposium – Romain Fraux – April 23, 2019
- Market Briefing: Advanced Packaging Trends in this Era of Digital New Age – Advanced Packaging & System Integration Symposium – Favier Shoo & Santosh Kumar – April 22, 2019
- What is driving the TSV business: Market & Technology Trends – IMAPS DPC – Santosh Kumar – March 6, 2019
- Packing trends and challenges for the next generation automotive – IMAPS DPC – Santosh Kumar – March 5, 2019
- Mega trends & advanced packaging are reshaping the ways oftesting systems – TestConX – Mario Ibrahim – Mars 5, 2019
- Trends In Automotive Packaging – European 3D Summit – Thibault Buisson – January 30th, 2019
- 2018, the Golden Year for 3D Integration – European 3D Summit – Thibault Buisson – January 22nd 2018
- Material Trends in Advanced Packaging – Semicon Korea – Santosh Kumar – February 1st 2018
- Main Challenges & Roadmaps in Packaging in Consumer, Industrial and Automotive Applications – ZVEI AVT Congress – Jean-Christophe Eloy – February 19th 2018
- European Competitiveness in Semiconductor More than Moore Applications: What could happen now? – ISS Europe – Jean-Christophe Eloy – March 5th 2018
- Fan-Out Packaging: Wafer and panel technologies and market trends – IMAPS 2018 – Jérôme Azémar – March 8th 2018
- 2018 a turning point for 3D TSV integration: will AI be the real opportunity for 3D and 2.5D integration? – IMPAS 2018 – Emilie Jolivet – March 2018
- High End Performance Application key Driver for Advanced Packaging – MINAPAD – Emilie Jolivet – May 16th 2018
- MEMS Sensor and IC advanced package: How automotive and AI will challenge packaging business – NEPCON – Emilie Jolivet – January 17th 2018
#BATTERY & ENERGY MANAGEMENT
- How will battery pack requirements impact power electronic market? – PCIM Europe – Milan Rosina – May 7th 2018
- How battery pack evolutions create opportunities for power electronics companies – Semicon Europa – Milan Rosina – November 15th 2018
- 2018, How EV/HEV drive the battery technology development
#COMPOUND SEMICONDUCTORS
- GaN & SiC Power Devices Market Overview – SCAPE – Hong Lin – May 14th, 2019
- SiC Power MOSFETs Technology & Cost Review – SCAPE – Amine Allouche – May 14th, 2019
- SiC and GaN impact on traditional Si Power electronics industry – PCIM Europe – Ana Villamor – May 7th, 2019
- Innovators in Power SiC – CS International 2019 – Rémi Comyn from Knowmade – March 26th 2019
- SiC and GaN adoption by EV/HEV market – CS International 2019 – Hong Lin – March 26th 2019
- What can power electronics industry expect from SiC and GaN ? – APEC 2019 – Ana Villamor – March 19th 2019
- Business Models for GaN and SiC Markets – APEC – Ana Villamor – 2018
- SiC and GaN, which challenges remain in the road to success? – PCIM Europe – Ana Villamor – May 5th 2018
- SiC Material EV/HEV Module – SCAPE 2018 – Elena Barbarini from System Plus Consulting – June 2018
- Recent GaN on Si HEMT – SCAPE 2018 – Elena Barbarini from System Plus Consulting – June 2018
#POWER ELECTRONICS
- Power Module Packaging: Market and Technology Trends – Market Briefing PCIM Europe – Milan Rosina and Elena Barbarini – May 8th, 2019
- What are the impacts of the battery, power electronics and electric motor global trends on the EV/HEV industry? – PCIM Europe – Milan Rosina – May 9th, 2019
- Power Electronics: An application driven market – APEC 2019- Ana Villamor – March 19th 2019
- Is EV/HEV a Driver for Innovation in Power Electronics? – Automotive World – Mattin Grao – 2018
- Gate Drivers market evolution: coreless isolation and WBG specific solutions – APEC – Mattin Grao – 2018
- Is EV/HEV a Driver for Innovation? – APEC – Pierric Gueguen – 2018
- Status of Power Electronic Industry: Market and Technology Trends – APEC – Mattin Grao – 2018
- Automotive Power Modules Design and Technology Innovations to Come – PCIM Europe – Claire Troadec – May 6 th 2018
- SiC power devices and modules: Competitive landscape analysis from a patent perspective – PCIM Europe – Audrey Bastard from KnowMade – May 7th 2018
- EV/HEV Automotive Power Modules: Innovations and trends – PCIM Europe – Elena Barbarini from System Plus Consulting – 2018
- GaN and SiC power device: market overview – Semicon Europa – Milan Rosina – November 15th 2018
#RF DEVICES & TECHNOLOGIES
- 5G’s Impact on the RF Front-End Industry – CS Mantech – Ezgi Dogmus – April 30th, 2019
- Advanced RF Packaging Technology Trends, on the way to 5G and mmWave Applications – Advanced Packaging & System Integration Symposium – Romain Fraux – April 23, 2019
- Towards ADAS to Imaging radar for automotive market and technology trends – RF & Microwave – Cédric Malaquin – March 21 2019
- ADAS/AD Sensor & Market Technology Trend – VDI Wissensforum – Cédric Malaquin – February 14th 2019
- 5G RF Front-End: Who has the most to win (and lose) ? – Semicon Europa – Claire Troadec – November 14th 2018
- 5G’s Impact on the RF Front-End Industry – SIP Conference China – Cedric Malaquin – Ocotber 17th 2018
#SOLID-STATE LIGHTING
- After 20 years, the VCSEL business has found its killer application…– VCSEL Day – Pierrick Boulay – May 10th, 2019
- 3D Imaging/Sensing: The Next Killer Application for VCSEL ? Yes if… – CS Mantech – Pars Mukish – May 2nd, 2019
- 3D Imaging/Sensing the Next Killer Application for Laser Diodes – CS International – Pars Mukish – March 27th, 2019
- UVC LEDs: Towards high power and new applications – IUVA World Congress – Pierrick Boulay – February 11th, 2019
- From Visible to UV and IR: Niche Markets are Gaining Momentum in the LED Industry – Lighting Days – Pars Mukish – February 13th, 2019
- Automotive Lighting: Change of Paradigm & Great Future – DVN Workshop – Pars Mukish – January 30th 2018
- How digital lighting will further revolutionize automotive lighting – LPS – Pierrick Boulay – September 25th 2018
- Horticultural LED Lighting Market, Industry and Technology Trends – LPS – Pierrick Boulay – September 25th 2018
#DISPLAY
- AR for consumer markets the display and optics challenges yet to overcome – Leti Days – Zine Bouhamri – June 24, 2019
- Consumer adoption of AR headsets: the challenges to overcome (a focus on displays and optics) – Display Week 2019 – Zine Bouhamri – May 14th, 2019
- MicroLED Displays: Hype and Reality, Hopes and Challenges – CS Mantech – Pars Mukish – May 2nd, 2019
- Overcoming the challenges on the path to consumer AR headsets – ICDT 2019 – Zine Bouhamri – March 29, 2019
- MiniLEDs and MicroLEDs in today’s markets: status and challenges – ICDT 2019 – Zine Bouhamri – March 28, 2019
- Is 2019 going to be the year for MicroLEDs? – ICDT 2019 – Zine Bouhamri – March 26, 2019
- Emerging Display Technologies and Impact for Downconverters – Phosphor Global Summit and Quantum Dots Forum – Eric Virey – March 20, 2019
- Status of the MicroLED Industry – Phosphor Global Summit and Quantum Dots Forum – Eric Virey – March 19, 2019
- Mini- and Micro-LED Displays: Hype and Reality – Lighting Days – Pars Mukish – February 13th, 2019
- Emerging technologies and alternative to OLED – OLED Korea Conference – Zine Bouhamri – March 7th 2018
- Revolutionizing Displays with MicroLEDs? – FPD China – Pars Mukish – March 14th 2018
- LED Downconverters: Status of the Phosphors and Quantum Dots Industries – Phosphor Global Summit & Quantum Dots Forum – Eric Virey – March 14th 2018
- Status and Prospects of Micro-LED Displays – Display Week – Eric Virey – May 24th 2018
- The IP Landscape of Electroluminescent Quantum Dots Technology: Trends and Opportunities – IMID – Zine Bouhamri – August 29th 2018
- MicroLED Displays: Hype and Reality, Hopes and Challenges – IMID – Eric Virey – August 30th 2018
- A Credible Alternative to OLEDs? – OLEDs World Summit – Zine Bouhamri – September 19th 2018
#MEMS, SENSORS, ACTUATORS
- Sensing and computing for AV’s: Market data – Sensors Expo & Conference – Autonomous vehicle sensors conference – Dimitrios Damianos – June 25th, 2019
- Megatrends Impacts on MEMS – MEMS Engineer Forum 2019 – Jean-Christophe Eloy – April 24th, 2019
- LiDAR: From Space to Road – SSI International Conference 2019 – Alexis Debray – March 26th, 2019
- Megatrends Impacts on MEMS – MEMS World Summit 2019 – Eric Mounier – March 19th, 2019
- Sensing and Processing for Intelligent Driving – Automotive Intelligent Driving Innovation Summit 2019 – Dimitrios Damianos – March 19th, 2019
- What are the sensors enabling robotic cars ? – Semicon Taiwan – Jean-Christophe Eloy – April 9th 2018
- Status, Challenges and Opportunities for MEMS and Sensors – Semicon Europa – Eric Mounier – November 14th 2018
- Disruption and Sensors in the future of transportation – Minalogic – Journée Thématique : Véhicule du futur – Jérôme Azemar – October 23rd 2018
- Megatrends’ Impacts on the MEMS Business – MEMS European Summit – Eric Mounier – September 2018
- The Automotive market will shape the future of LiDAR – The multi-billion dollars opportunity – 1st Executive Forum on LiDAR for Automotive – Guillaume Girardin – September 6th 2018
- The perceptual era of IoT has begun…Mobile phones first – Sensors Expo & Conference – Guillaume Girardin – June 26th 2018
- MEMS & Sensors for Next Generation Automotive – Flex korea – Jérôme Azemar – June 21st 2018MEMS & Sensors for Next Generation Automotive – Flex korea – Jérôme Azemar – June 21st 2018
- What are the sensors enabling robotic cars ? – Semicon Taiwan – Jean Christophe Eloy – April 19th 2018
- Status of the MEMS Industry: What Are the Drivers for the Next 10 Years (and Who will Take Benefit of It)? – MEMS Engineer Forum – Jean Christophe Eloy – April 26th 2018
- The rise of the high-end inertial sensing market is discretely nourished by the ‘robotic vehicles’ trend – HES International – Guillaume Girardin – April 10th 2018
#PHOTONICS & OPTOELECTRONICS
- Silicon Photonics, beyond the tipping point – Leti Days 2019 – Eric Mounier – June 2019
- Si Photonics, current status & future perspectives – PIC International – Eric Mounier – Aprill 11th 2018
#IMAGING
- Sensing technologies and market trends in automotive – Jérôme Azemar – Flex Japan 2019 – May 22nd 2019
- Gesture Recognition and 3D Sensing Technologies for Mobile Devices – SSI International 2019 – Paul Leclaire from Knowmade – March 26, 2019
- Imaging for ADAS and AVs – The great disruption – Pierre Cambou – February 24, 2019
- Robotic Vehicles, the New Paradigm for Mobility as a Service – COMS Conference – Guillaume Girardin – September 21, 2018
- Imaging & Sensing Market Status – Imaging & Sensors European Summit – Pierre Cambou – September 2018
- From 2D to 3D: How Depth Sensing Will Shape the Future of Vision – Embedded Vision Summit – Guillaume Girardin – May 22, 2018
#PCB, WAFER, SUBSTRATE #EQUIPMENT & MATERIALS
- Equipment Manufacturing Trends for More than Moore devices – EVG Tech Day – Amandine Pizzagalli – June 4, 2019
- Manufacturing challenges and Trends in MEMS integration – Chemnitz Seminar – Amadine Pizzagalli – May 21, 2019
- Nano Imprintfor Photonic applications – NiLIndustrial Day – Amandine Pizzagalli – March 28, 2019
- Trends in Lithography for More than Moore applications – LithoVision 2019 – Jérôme Azémar – February 24, 2019
- Lithography Technologies for More than Moore – the European Mask and Lithography Conference – Amandine Pizzagalli – June 18, 2018
- How megatrends will impact MEMS & Sensors – Leti Innovation Days – Eric Mounier – July 3, 2018
- 3D Bonding Technologies – Semicon West – Amandine Pizzagalli – July 23, 2018
- Wafer Starts for More than Moore – Market Trends – Semicon Europe – Amandine Pizzagalli – November 13, 2018
#SOFTWARE & COMPUTING
- On the road to augmented intelligence – Embedded Vision Summit – Yohann Tschudi – May 2019
- Road to Robots: Computing for autonomous automotive – Sensors Expo & Conference – Yohann Tschudi – June 26, 2018
#MICROFLUIDICS #BIOTECH #BIOMEMS #BIOPHOTONICS
- The promises of medical wearables for printed electronics – OE-A 2019 – Jérôme Mouly – June 13, 2019
- Micro-machined ultrasonic transducers are coming to market: why now? – MUT 2019 – Marjorie Villien PhD – June 11, 2019
- Solid State Sensors to shape the future of of Medical Imaging – European Photonics Roadshow Newcastle – Benjamin Roussel – April 3, 2019
- Microsystems & bioMEMS for Healthcare applications – #LetsCluster – Benjamin Roussel – March 26, 2019
- What are the technological trends in the field of X-ray imaging – IS Europe 2019 – Marjorie Villien -March 13, 2019
- Microfluidic technologies are taking point-of-care testing to the next level – Med TriCon 2019 – Sebastein Clerc – March 11, 2019
- How will sensor technologies impact the medical robot of the future? – Medisens 2018 – Marjorie Villien – February 27, 2018
- When wearables meet connected healthcare: ready for a disruption? – Medical Wearables 2018 – Benjamin Roussel – May 17, 2018
- Convergence of Biosensors and mHealth: application trends and market opportunities – IEK Forum 2018 – Jérôme Mouly – May 22, 2018
- Point of Need Testing & Liquid Biopsy Technology and Market Overview:Challenges, market trends and new solutions – LOAC Europe 2018 – Asma Siari – June 5, 2018
- Birth of a Future Giant: Zoom on the Chinese Microfluidics Industry – LOAC World Congress – Sébastien Clerc – October 2018
- CRISPR Technology & Market Overview: challenges, market competition landscape and strategic opportunities – Precision CRISPR Congress – Asma Siari – October 23, 2018
- Micromachined Ultrasound Technologies: An Overview of Emerging Trends and Applications – Medical MEMS and sensors 2018 – Jérôme Mouly – November 7 2018
#INKJET PRINTING
- Inkjet printing Drawing its success story in electronic and bio-printing fields – AFIP 2019 – Jérôme Mouly – March 28, 2019
#MEMORY
- Market Briefing AI HPC and Memory – Advanced Packaging & System Integration Technology Symposium – Emilie Jolivet & Thibault Buisson – April 22, 2019
- Semiconductor memory technologies: innovations and competitive landscape – Semicon China 2019 – Simone Bertolazzi – March 20, 2019